Overmoulded Optoelectronic Sensor Panel Manufacturing

Solution Overview

Problem

The conventional production of miniature optoelectronic sensors is hindered by the complexity and cost increase due to manual handling of sub-miniature components, requiring intricate automation devices.

Innovation Solution

A method for producing optoelectronic sensors that involves assembling electronic and mechanical components on a printed circuit board panel, which is then treated as a whole unit, using a plate-shaped carrier element and injection molding to create overmoulded sensor modules without individual component handling, leveraging SMD technology and pick-and-place systems for simplified and cost-effective automation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If manual handling of sub-miniature components is used, then production flexibility is maintained, but production costs increase and complexity increases

Engineering Contradiction:

Improveproduction costVSAvoidautomation device complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

Multiple individual sensor components are merged into a single printed circuit board panel structure, allowing simultaneous processing of multiple sensors as one unit. This combining approach eliminates the need for complex individual component handling while maintaining production efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The printed circuit board panel is divided into multiple segments or sections, each containing individual sensor components. This segmentation allows the panel to be processed as a whole while still enabling individual sensor identification and handling at specific locations.

Inventive Principle:

Principle #1Segmentation

2Productivity

If individual miniature components are processed separately, then component precision is maintained, but productivity decreases

Engineering Contradiction:

Improveproduction throughputVSAvoidautomation device complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

Multiple individual sensor components are merged into a single printed circuit board panel structure, allowing simultaneous processing of multiple sensors as one unit. This combining approach eliminates the need for complex individual component handling while maintaining production efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Components are pre-assembled onto the printed circuit board panel in their final positions before the main production process. This preliminary arrangement eliminates the need for complex real-time positioning during production, simplifying automation requirements.

Inventive Principle:

Principle #10Preliminary action

3Productivity

If conventional production methods are used for miniature sensors, then manufacturing precision is maintained, but productivity decreases

Engineering Contradiction:

Improveproduction throughputVSAvoidsensor miniaturization precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

Multiple individual sensor components are merged into a single printed circuit board panel structure, allowing simultaneous processing of multiple sensors as one unit. This combining approach eliminates the need for complex individual component handling while maintaining production efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The production approach transitions from processing individual components in one dimension to processing multiple components simultaneously on a panel in two dimensions. This dimensional change enables parallel processing while maintaining individual component precision through the panel structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies miniaturization and reduces production costs by enabling simultaneous processing of multiple sensors with conventional devices, eliminating the need for complex automation and reducing manufacturing expenses through efficient use of existing injection molding tools.

Implementation Method 1

the injection molding tool having two mold halves, with the printed circuit boards carrying the optoelectronic sensors being separated as sensor modules when the mold halves of the injection molding tool are closed

Methodology Applied

Scientific EffectInjection molding:

Implementation Method 2

The refractory plate is made of a refractory material such as a polymer or thermoset. These materials can withstand the temperatures in a soldering oven, i.e. an SMD oven, during the SMD soldering process

Methodology Applied

Scientific EffectThermal resistance:

Implementation Method 3

The semiconductor chips are then overmoulded using a compression molding process and then separated

Methodology Applied

Scientific EffectCompression molding:

Data Source

PatentEP3471518B1Method for producing optoelectronic sensors, in particular miniature sensors

Publication Date: 2020.02.26 SICK AG

Figure 1a~1c
Figure 1d~1e
Figure 1f~1g

AI summary

The invention relates to a method for manufacturing optoelectronic sensors, preferably miniature sensors, in which several printed circuit boards (2) connected in a printed circuit board panel (1) are automatically populated with electronic components (5), which are overmolded and separated. In a method in which miniature components can be manufactured particularly easily, after the individual printed circuit boards (2) of the printed circuit board panel (1) have been populated with electronic components (5), optical (9) and mechanical (8) components are applied to each printed circuit board (2) of the printed circuit board panel (1) to complete the assembly of an optoelectronic sensor.