Via-Embedded Passive Devices for PCB Space and Thermal Management
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Solution Overview
Problem
Printed circuit boards (PCBs) face space constraints due to the need for discrete passive components like inductors, capacitors, and resistors, which occupy valuable real estate on the board.
Innovation Solution
Integrating passive devices such as inductors, capacitors, and resistors within vias of the PCB, allowing them to extend between layers and eliminating the need for surface-mounted components, thereby conserving space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive devices are mounted as discrete components on the PCB surface, then they can be easily installed and connected, but they consume valuable board space
Solution Approach 1:
The passive device is nested within the via structure, which extends through the PCB layers. The via acts as a container that houses the passive device, allowing the component to be integrated within the board structure rather than mounted on the surface. This nesting approach eliminates the need for separate surface mounting while maintaining connection capabilities through the via's conductive path.
Solution Approach 2:
The solution transitions from two-dimensional surface mounting to three-dimensional integration by placing the passive device vertically within the via. This dimensional change allows the component to occupy the thickness dimension of the PCB rather than consuming valuable planar surface area, effectively moving the component from the board surface into the board's depth.
2Area of stationary object
If passive devices are integrated within vias, then board space is conserved, but thermal transfer and wicking issues may be affected
Solution Approach 1:
The via structure, which could potentially cause wicking issues when containing passive devices, is converted into a beneficial thermal management solution. The conductive material filling the via creates a thermal pathway that facilitates heat dissipation from the passive device directly into the PCB's ground and power planes, transforming a potential harmful effect into a useful thermal conduction mechanism.
Solution Approach 2:
The physical and chemical parameters of the via are modified by filling it with conductive material that also provides thermal conduction pathways. This parameter change enables the via to simultaneously serve as an electrical connection, mechanical support, and thermal management structure, allowing heat to be efficiently transferred from the passive device to the PCB's thermal mass.
Data Source
AI summary
A circuit board is provided that includes a plurality of insulating layers provided in a stack to have a first surface and a second surface. A via may extend from the first surface of the stack to the second surface of the stack. A passive device may be provided in the via.