Embedded Component Adhesive Segmentation for Delamination Reduction
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Solution Overview
Problem
Conventional adhesive techniques for electronic components on printed circuit boards require large amounts of adhesive material, leading to air-filled gaps, internal stress, delamination, and humidity-related issues, which compromise the robustness and stability of electronic devices.
Innovation Solution
An electronic device design where the adhesive structure covers only a portion of the electronic component's surface, with the remaining surface covered by the component carrier body, using a dielectric or conductive adhesive layer, and embedding the component with an insulating structure to minimize gaps and enhance robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material covers the whole surface of the electronic component, then the electronic component is securely fixed to the component carrier, but a huge amount of adhesive material is required leading to air-filled gaps, internal stress, and delamination risks
Solution Approach 1:
The adhesive structure is segmented into multiple adhesive sub-structures (e.g., adhesive dots or patches) distributed across the surface of the electronic component. This segmentation allows secure fixation while reducing the total amount of adhesive material needed, eliminating air-filled gaps and preventing delamination during high-temperature manufacturing steps.
2Strength
If adhesive material covers the whole surface of the electronic component, then the electronic component is securely fixed to the component carrier, but air-filled gaps form between the adhesive material and the electronic component leading to pressure and stress during manufacturing
Solution Approach 1:
The adhesive sub-structures are pre-applied to specific locations on the electronic component surface before component placement. This preliminary action ensures that adhesive is present only where needed for bonding, preventing air gap formation between the adhesive and component surface during subsequent high-temperature and pressure manufacturing steps.
3Strength
If adhesive material covers the whole surface of the electronic component, then the electronic component is securely fixed to the component carrier, but the adhesive material absorbs high humidity leading to delamination
Solution Approach 1:
The adhesive structure is divided into multiple discrete adhesive sub-structures rather than a continuous layer. This segmentation significantly reduces the total surface area of adhesive material, thereby reducing humidity absorption and the associated risk of delamination during storage and manufacturing while maintaining adequate adhesion strength.
4Strength
If adhesive material forms a meniscus extending beyond the electronic component edges, then the electronic component is securely fixed, but the meniscus acts like a ramp causing further layers to slip and impeding registration
Solution Approach 1:
The adhesive sub-structures are positioned locally on the electronic component surface, confined within the component edges without forming menisci. This local quality approach ensures adhesion strength at the component-carrier interface while eliminating the ramp effect that would cause layer slippage and registration errors during subsequent manufacturing steps.
5Strength
If adhesive material forms a meniscus extending beyond the electronic component edges, then the electronic component is securely fixed, but the meniscus hinders the arrangement of adjacent electronic components
Solution Approach 1:
The adhesive sub-structures are localized to specific positions on each electronic component, confined within the component boundaries. This localization eliminates meniscus formation that would extend beyond component edges, thereby maximizing the available area for arranging adjacent electronic components closely together on the component carrier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of delamination, internal stress, and moisture absorption, while allowing for precise alignment and increased miniaturization, resulting in a more stable and robust electronic device with reduced adhesive material usage.
Implementation Method 1
an adhesive structure (230) which adhesively connects the electronic component (250) to the electrically conductive layer (220), wherein the adhesive structure (230) covers only a first part (260) of one surface of the electronic component (250)
Data Source
AI summary
An electronic device includes a component carrier with a component carrier body, an electrically conductive layer, and an adhesive structure. The electronic device further includes an electronic component which is arranged within the component carrier body. The adhesive structure is formed between a surface of the electronic component and the electrically conductive layer and covers only a part of the surface of the electronic component. A remaining part of the surface of the electronic component is covered with the component carrier body.