Probing Device Space Transformer Alignment Manufacturing
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Solution Overview
Problem
The existing probing devices for semiconductor testing face challenges in cost efficiency due to the need for redesign and remanufacturing when transitioning from single-DUT to multi-DUT configurations, as the space transformer positioning can shift during reflow soldering, leading to misalignment and reduced mechanical strength.
Innovation Solution
A manufacturing method that involves a reinforcing plate with multiple space transformers, where a photoresist film with metal layers forms second pads to ensure alignment and mechanical strength, allowing the use of single-DUT space transformers in multi-DUT devices, thereby maintaining cost-effectiveness and mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple space transformers are disposed on a PCB for multi-DUT testing, then testing efficiency is improved, but manufacturing cost increases due to redesign and remanufacturing requirements
Solution Approach 1:
The space transformer is designed with a universal structure that can be used in both single-DUT and multi-DUT probing devices. By standardizing the space transformer design with consistent pad layouts and mounting interfaces, the same component can serve multiple testing configurations, eliminating the need for redesign when transitioning from single-DUT to multi-DUT setups.
Solution Approach 2:
The pad layout on the space transformer is pre-designed and pre-positioned during manufacturing to ensure proper alignment with probe tips. The pads are arranged in advance with precise spacing and positioning, so that when multiple space transformers are mounted on the PCB, they automatically align with the corresponding probe arrays without requiring additional adjustment or redesign.
2Ease of manufacture
If space transformer is fixed onto PCB using reference base positioning, then positioning is simplified, but alignment precision deteriorates due to position shift during reflow soldering
Solution Approach 1:
The invention changes the physical state and properties of the bonding interface by using a two-stage process: first mechanical positioning with reference bases, then thermal reflow soldering that creates strong metallurgical bonds. The soldering parameters (temperature, time, atmosphere) are optimized to ensure the space transformer remains stationary once bonded, preventing position shifts while maintaining manufacturing simplicity.
Solution Approach 2:
The invention introduces solder as an intermediary material between the reference base and the space transformer. The solder acts as a mediator that transfers and stabilizes the position, ensuring that the space transformer maintains its aligned position during and after the reflow process. The solder joint serves as a rigid connector that prevents any position shift.
3Productivity
If probe head comprises multiple probing areas for multi-DUT testing, then testing capacity increases, but mechanical strength deteriorates
Solution Approach 1:
The probe head is segmented into multiple independent probing areas, each with its own set of probes and corresponding space transformer mounting position. This segmentation allows each probing area to be optimized for specific testing requirements while maintaining overall structural integrity through the unified PCB and cage assembly.
Solution Approach 2:
Multiple probing areas and their corresponding space transformers are merged onto a single rigid PCB structure, which is then combined with a reinforcing cage assembly. The cage provides external mechanical support that compensates for the distributed structure, ensuring overall mechanical strength is maintained despite the segmented probing areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the effective use of single-DUT space transformers in multi-DUT probing devices, reducing production costs and ensuring reliable electrical connections and mechanical strength, while maintaining alignment and contact between probes and pads.
Implementation Method 1
forming a photoresist film on the space transformer, wherein the photoresist film comprises a plurality of openings and the first pad is disposed in the opening
Implementation Method 2
forming a metal layer in each of the plurality of openings, wherein the metal layer covers the plurality of first pad for forming a plurality of second pads
Implementation Method 3
the reinforcing plate 25 is utilized to increase the overall mechanical strength of the multi-DUT probing device 20
Implementation Method 4
testing signals received by the probes 162 can be transferred to the PCB 12 via the space transformer 14, for further follow-up analysis
Data Source
AI summary
A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.