Electronic Device Substrate Electrical Connection via Funnel Hole
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Solution Overview
Problem
Existing electronic devices with thin bezel structures face challenges in achieving efficient electrical connections between substrates while maintaining a compact design and reducing production costs, particularly in display devices where additional wiring substrates are needed for sensor connections.
Innovation Solution
The electronic device incorporates a first substrate with a conductive layer and a second substrate separated by a funnel-shaped or bowl-like hole, allowing a connecting material to bridge the conductive layers, eliminating the need for additional wiring substrates by forming a contact hole that penetrates both substrates and includes a concavity on the second substrate, which is expanded through etching and filled with a conductive layer using laser irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional wiring substrates are used to connect sensors between the first and second substrates, then electrical connectivity is improved, but device complexity and production cost increase
Solution Approach 1:
The patent merges the wiring substrate function into the existing first and second substrates by forming conductive layers directly on these substrates. The sensor is electrically connected to the first substrate through a contact hole and conducting material, eliminating the need for a separate wiring substrate while maintaining electrical connectivity functionality.
Solution Approach 2:
The patent extracts the wiring substrate as a separate component and integrates its functionality directly into the substrate structure. By forming conductive layers and contact holes within the existing substrates, the dedicated wiring substrate is removed, simplifying the overall device structure.
2Reliability
If additional wiring substrates are used to connect sensors between the first and second substrates, then electrical connectivity is improved, but production cost increases
Solution Approach 1:
The patent combines multiple functions (substrate support, electrical connection, and wiring) into the existing substrate structure. By forming conductive layers directly on the first and second substrates and using contact holes for sensor connection, it eliminates the need for a separate wiring substrate, thereby reducing material costs and simplifying the manufacturing process.
3Volume of moving object
If a thin bezel structure is achieved, then device compactness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent forms a concavity in the second substrate before forming the contact hole. This preliminary action creates a tapered structure that guides the conducting material and facilitates precise alignment, thereby reducing the manufacturing precision requirements for the final hole formation while maintaining the thin bezel structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a thin bezel structure with reduced production costs by eliminating the need for additional wiring substrates and enhancing electrical connectivity, thereby achieving a compact design and efficient signal transmission in display devices.
Implementation Method 1
irradiating an area where the concavity is formed with a laser light to form a hole penetrating at least the second conductive layer in the concavity and the second basement
Data Source
AI summary
An electronic device is provided and including a first substrate including a first glass substrate and a first conductive layer; a second substrate including: a second glass substrate which is disposed to be apart from the first conductive layer and includes a first surface opposed to the first conductive layer and a second surface opposite to the first surface, a second conductive layer disposed on the second surface, and a first hole penetrating the second glass substrate; and a connecting material electrically connecting the first conductive layer and the second conductive layer via the first hole, wherein the first hole is shaped as a funnel, and the connecting material includes a hollow part in which an insulative filling material is filled.