Substrate Traces for EMI Shielding in IC Packages
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Solution Overview
Problem
Current EMI shielding techniques for smaller electronic devices are not compatible with shrinking die package assembly dimensions, making it difficult to achieve a smaller form factor and reduced z-height while effectively shielding against electromagnetic interference.
Innovation Solution
The use of substrates with traces configured in a grid arrangement to provide EMI shielding, where one substrate is rigid and the other is flexible, allowing for a reduction in z-height and form factor, and potentially integrating additional functionalities like solar panels or displays, with interconnect structures forming a Faraday cage around the die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If stamped metallic sheets or cages are glued to package assembly for EMI shielding, then EMI shielding effectiveness is improved, but z-height and form factor increase
Solution Approach 1:
The patent combines the EMI shielding function with the package substrate itself by integrating conductive traces directly into the substrate layers. This merging eliminates the need for separate metallic shielding sheets or cages, thereby maintaining EMI protection while reducing z-height and form factor.
Solution Approach 2:
The package substrate is designed to serve multiple functions simultaneously: it provides mechanical support, electrical interconnection through traces, and EMI shielding protection. This multi-functionality allows the substrate to replace dedicated shielding components, reducing overall package dimensions.
2Object-affected harmful factors
If stamped metallic sheets or cages are glued to package assembly for EMI shielding, then EMI shielding effectiveness is improved, but device size and form factor increase
Solution Approach 1:
The EMI shielding function is merged with the package substrate structure by embedding conductive traces within the substrate layers. This integration eliminates the need for external metallic shielding components, thereby reducing the overall device area and form factor while maintaining shielding effectiveness.
Solution Approach 2:
The patent transitions from three-dimensional metallic shielding structures (sheets or cages) to two-dimensional trace patterns embedded within the substrate plane. This dimensional change allows EMI protection to be achieved within the substrate footprint without adding external volume or area.
3Stability of the object's composition
If rigid substrates are used for EMI shielding, then structural stability is improved, but flexibility and integration of additional functionalities are reduced
Solution Approach 1:
The patent employs composite substrate structures that combine rigid and flexible material properties. These composite substrates maintain structural stability for reliable EMI shielding while incorporating the flexibility needed to integrate additional functionalities such as solar panels or displays within the package assembly.
Solution Approach 2:
The substrate is designed as a universal platform that simultaneously provides structural support, EMI shielding through conductive traces, and integration capability for additional functionalities. This multi-functional design allows rigid structural stability while accommodating versatile component integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the z-height and form factor of IC package assemblies while providing robust EMI shielding, allowing for the integration of additional functionalities and improved shielding effectiveness by forming a Faraday cage around the die.
Implementation Method 1
at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die
Data Source
AI summary
Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.