Electronic Device Through-Electrode Sealing via Conductive Adhesive
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Solution Overview
Problem
Existing electronic devices with vibrating elements face challenges in maintaining airtightness due to gaps between through-electrodes and the base substrate, which are exacerbated by size reductions and manufacturing variations, leading to compromised vibration characteristics and reliability.
Innovation Solution
The implementation of an electronic device configuration that includes a base substrate with through-electrodes covered by electrically conductive adhesives, which serve as both covering members and electrical connectors, enhancing airtightness by sealing the through-electrodes and reducing the number of components needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the width of the opening edge surface of the lid is reduced to achieve size reduction, then the electronic device size is reduced, but it becomes difficult to form a through-electrode at the portion and the through-electrode may protrude due to manufacturing variations
Solution Approach 1:
The invention divides the covering function into two parts: the lid portion covers the electronic component from above, while the resin layer fills and seals the gap around the through-electrode from the side. This segmentation allows the through-electrode to be formed independently without requiring precise alignment with the lid opening edge, solving the manufacturing precision issue while maintaining compact size.
Solution Approach 2:
The resin layer acts as an intermediary material that fills the gap between the through-electrode and the lid portion. It compensates for manufacturing variations and protrusions of the through-electrode, ensuring airtight sealing without requiring high precision in through-electrode formation or reduced lid opening width.
2Volume of moving object
If the through-electrode is formed just below the glass (bonding member) to achieve size reduction, then the electronic device size is reduced, but the through-electrode is damaged by heat applied in bonding of the lid to the base substrate
Solution Approach 1:
The resin layer serves as a heat-insulating intermediary between the through-electrode and the lid portion during the bonding process. It protects the through-electrode from direct exposure to high bonding temperatures, preventing damage while allowing the lid to be bonded close to the through-electrode for compact device size.
Solution Approach 2:
The resin layer is formed beforehand to cover and protect the through-electrode before the lid bonding process. This prior cushioning prevents heat damage to the through-electrode during subsequent high-temperature bonding operations, ensuring through-electrode integrity in compact device designs.
3Reliability
If a separate covering member is used to cover the through-electrode to improve airtightness, then the airtightness of the accommodating space is improved, but the number of components and device size increase
Solution Approach 1:
The invention merges the covering function with the bonding material itself. The resin layer that bonds the lid to the base substrate simultaneously covers and seals the through-electrode, eliminating the need for a separate covering member. This integration maintains excellent airtightness while reducing the number of components and simplifying device structure.
Solution Approach 2:
The resin layer performs multiple functions simultaneously: it bonds the lid to the base substrate, seals the gap around the through-electrode to ensure airtightness, and protects the through-electrode from heat damage. This multi-functionality eliminates the need for separate covering members, reducing device complexity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the airtightness of the accommodating space while allowing for size reduction and increased reliability by eliminating the need for separate covering members and fixing components, thus enhancing the overall performance and manufacturing efficiency.
Implementation Method 1
the through-electrode is configured so as to be covered with glass (bonding member) bonding the base substrate with the lid
Implementation Method 2
a configuration comprising a base substrate and a lid (lid portion) bonded together via a bonding member such as a brazing material
Data Source
AI summary
An electronic device has a vibrating element and a package accommodating the vibrating element. Moreover, the package has through-electrodes formed to penetrate a base substrate in its thickness direction and electrically connected with connection terminals, and electrically conductive adhesives (covering members) formed above the connection terminals so as to contain the through-electrodes.