Electronic Component Mounting Machine Viscous Fluid Transfer Control
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Solution Overview
Problem
Existing electronic component mounting machines face challenges in accurately transferring an appropriate amount of viscous fluid to the bumps of electronic components, leading to inefficiencies in the mounting process.
Innovation Solution
The electronic component mounting machine incorporates a flux unit with a squeegee mechanism and adjustable film thickness control, allowing for precise transfer of viscous fluid to the bumps by adjusting the film thickness based on image data analysis to ensure the right amount is applied, within a 30% to 60% height range of the bump, thereby optimizing the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the bump is immersed in viscous fluid stored in a storage section, then the viscous fluid is transferred to the bump, but it is difficult to control the transfer amount to be appropriate
Solution Approach 1:
The squeegee mechanism is introduced to dynamically control the transfer process. By adjusting the squeegee position and applying pressure, the system can precisely control the amount of viscous fluid transferred to the bump, transforming the static immersion process into a dynamic, controllable operation that achieves appropriate transfer amounts consistently
Solution Approach 2:
The invention changes the transfer mechanism from simple immersion to a controlled squeegee-based process where parameters such as squeegee pressure, speed, and position can be adjusted. This allows precise control over the transfer amount of viscous fluid, ensuring appropriate quantities are applied to each bump
2Reliability
If the film thickness of viscous fluid is increased to ensure adequate coverage, then wettability is improved, but excessive fluid application occurs
Solution Approach 1:
The squeegee mechanism enables local control of fluid application, allowing different amounts of viscous fluid to be transferred to different bumps based on their specific requirements. This localized control ensures each bump receives the precise amount needed for adequate wettability without excessive fluid application
Solution Approach 2:
The imaging section captures images of the bumps before and after transfer, providing feedback on the transfer quality and fluid amount. This feedback loop allows the system to adjust the squeegee parameters to achieve the optimal balance between wettability and fluid quantity, preventing both insufficient and excessive application
Data Source
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AI summary
An electronic component mounting machine and a mounting method capable of transferring an appropriate amount of viscous fluid to a bump are provided. The electronic component mounting machine includes a storage section configured to store viscous fluid, a head section configured to hold an electronic component having a bump and to immerse the bump of the electronic component in the viscous fluid, an irradiation section configured to irradiate the bump, to which the viscous fluid has been transferred, with light, an imaging section configured to capture an image of the bump irradiated with light from the irradiation section, and a control device. The control device executes detection processing for detecting a transfer amount of the viscous fluid transferred to the bump based on image data captured by the imaging section, determination processing for determining whether the transfer amount is good or bad, and transfer processing for transferring the viscous fluid to the bump in accordance with the transfer amount being less than a predetermined threshold.