Laminated Electronic Component with Conductive Elastic Structure for Acoustic Noise Reduction

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Solution Overview

Problem

Laminated ceramic capacitors generate acoustic noise due to mechanical strain when connected to circuit substrates, and existing methods to mitigate this noise restrict the design freedom of the circuit substrate by requiring symmetrical capacitors on both sides.

Innovation Solution

A laminated electronic component with a conductive elastic structure connected to the external electrode at corner portions, which attenuates vibration and reduces acoustic noise without needing symmetrical capacitors on both sides of the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If symmetrical capacitors are mounted on both front and back surfaces of the circuit substrate to cancel vibration, then acoustic noise is reduced, but the degree of freedom in designing the circuit substrate is lost

Engineering Contradiction:
Improveacoustic noiseVSAvoiddegree of freedom in designing circuit substrate
Core Design Contradiction:
Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

An elastic structure is introduced as an intermediary between the capacitor and the circuit substrate. This elastic structure absorbs and attenuates the vibration generated by the capacitor, preventing it from being transmitted to the circuit substrate. By using this mediator, the patent achieves vibration cancellation without requiring symmetrical capacitor placement, thus maintaining design freedom while reducing acoustic noise.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses a simple elastic structure (which can be made of inexpensive materials like rubber or foam) to absorb vibration energy. This elastic component acts as a disposable or replaceable element that dissipates vibration energy through its material properties, eliminating the need for complex symmetrical capacitor arrangements while effectively reducing acoustic noise.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Object-affected harmful factors

If vibration is transmitted from capacitors to the circuit substrate, then acoustic noise is generated, but adding vibration suppression structures increases device complexity

Engineering Contradiction:
Improveacoustic noiseVSAvoidmounting structure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent employs an elastic structure in the form of a flexible element (such as an elastic sheet, rubber mount, or foam component) that interfaces between the capacitor and the circuit substrate. This flexible element absorbs vibration through its inherent elasticity and damping properties, providing effective vibration suppression without adding mechanical complexity to the mounting structure.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The elastic structure effectively reduces acoustic noise transmission to the circuit substrate, allowing for flexible mounting and design of the circuit substrate without the need for identical capacitors on both sides.

Implementation Method 1

a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface... The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity

Methodology Applied
Scientific EffectVibration attenuation: Damping

Implementation Method 2

The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS10629372B2Laminated electronic component and mounting structure thereof
Publication Date: 2020.04.21 MURATA MFG CO LTD
  • US10629372B2 patent drawing
  • US10629372B2 patent drawing
  • US10629372B2 patent drawing

AI summary

A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one end surface, and a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface in a portion where the external electrode covers the first main surface. The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity.