Electronic Component Mounting Substrate Positioning Accuracy

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Solution Overview

Problem

In electronic component mounting substrates, soldering during reflow processing can cause solder to spread, leading to shifting of components from their intended mounting position due to surface tension, affecting their functionality and accuracy.

Innovation Solution

Using a conductive adhesive for electrical connections at specific points on the substrate, such as corners or central positions, in combination with soldering at other points, to secure the component and prevent shifting during reflow processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering is performed by reflow processing, then electrical connection between electronic component and substrate is achieved, but electronic component shifts from intended mounting position due to solder spreading and surface tension

Engineering Contradiction:

Improveelectrical connectionVSAvoidmounting position accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The electrical connection points are segmented into two categories: at least two opposite corner points use conductive adhesive bonding, while other points use soldering. This segmentation allows the corner points to serve as positioning anchors that prevent component shifting, while other points provide electrical connection without causing position deviation

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different bonding methods are applied to different locations on the electronic component bottom surface. Conductive adhesive is specifically applied at opposite corner points where positioning is critical, while soldering is used at other points. This local differentiation ensures that the most position-sensitive areas are protected from solder-induced shifting

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If conductive adhesive is used for all electrical connections, then mounting position accuracy is improved, but manufacturing cost increases

Engineering Contradiction:

Improvemounting position accuracyVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

Instead of applying conductive adhesive at all connection points (excessive action), the invention applies it only at the minimum necessary number of points (at least two opposite corners) to achieve the positioning effect. This partial application reduces material cost and processing complexity while maintaining sufficient positioning accuracy

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method improves the mounting position accuracy of electronic components by stabilizing them against translation and rotation shifts, while minimizing manufacturing costs by selectively using conductive adhesive for critical connections.

Implementation Method 1

bonding using a conductive adhesive

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

the solder is heated and melted in a state where the electronic component is mounted thereon

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 3

The soldering is performed by so-called a reflow processing

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 4

Due to the surface tension of the solder generated at this time, the electro component is easily moved

Methodology Applied

Scientific EffectSurface tension: Surface Tension

Data Source

PatentUS11516923B2Electronic component mounting substrate and manufacturing method thereof

Publication Date: 2022.11.29 KOITO MFG CO LTD

AI summary

An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.