Gripping and Welding Device for Electronic Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of electronic components and welding elements, such as chips and nanosheets, makes their handling difficult due to small dimensions and sensitivity to static electricity, leading to challenges in precise and efficient manual assembly, which results in high costs and long assembly times.
Innovation Solution
A device for gripping and welding electronic components using suction means to retain both the components and welding material, with movable suction means to position the welding material for precise contact and delivery of an electrical impulse for melting, minimizing the risk of damage and ensuring accurate placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual manipulation is used to handle miniaturized electronic components, then the risk of static electricity damage increases, but automation reduces handling precision and flexibility
Solution Approach 1:
The patent replaces manual mechanical manipulation with an automated robotic system equipped with specialized suction means. The robotic arm with programmable control executes precise positioning movements, eliminating static electricity risks from manual handling while maintaining sub-millimeter positioning accuracy through automated control algorithms and sensors.
Solution Approach 2:
The patent employs suction-based gripping mechanisms powered by pneumatic systems to handle miniaturized components. The suction cups create vacuum pressure to securely hold fragile electronic components and welding materials without mechanical contact, enabling safe automated handling of sensitive parts while maintaining precise positioning through robotic motion control.
2Adaptability or versatility
If manual assembly is used for positioning electronic components, then flexibility is maintained, but assembly time increases significantly
Solution Approach 1:
The patent replaces manual assembly operations with an automated robotic system that can rapidly position and weld components. The programmable robotic arm executes pre-planned motion sequences, achieving assembly speeds impossible for manual operations while maintaining flexibility through software-controlled adaptability to different component types and welding parameters.
Solution Approach 2:
The patent implements preliminary positioning of components using suction means before the welding operation. The robotic system pre-positions the electronic component and welding material in precise locations, then executes the welding action. This preliminary arrangement enables rapid automated assembly while maintaining the flexibility to handle various component configurations through programmable control.
3Productivity
If welding means are in contact with electronic components during handling, then welding efficiency improves, but the risk of accidental damage increases
Solution Approach 1:
The patent segments the handling and welding functions into separate operational phases. The suction means handle and position components during transport, keeping welding means isolated. Only at the final welding position do the functions converge temporarily. This segmentation protects components from welding-related damage during most of the handling process while maintaining welding efficiency when needed.
Solution Approach 2:
The suction means act as an intermediary between the robotic system and the electronic components during handling. The welding means remain separate and only interact with components at the welding interface. This intermediary approach allows efficient welding when required while protecting components from accidental damage during transport and positioning through the gentler suction-based handling mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast, precise, and reliable automatic welding of electronic components onto substrates, reducing the risk of damage and assembly time while maintaining high precision and flexibility in handling.
Implementation Method 1
first suction means able, during use, to retain the electronic component and defining a first gripping area for the electronic component, second suction means able, during use, to retain a sheet of welding material
Implementation Method 2
welding means of the sheet of welding material, able, during use, to deliver an electrical impulse for melting the sheet of welding material
Data Source
Figure 1
Figure 1A
Figure 2~3
AI summary
A device (100) for gripping and welding electronic components (1) of the Chip-On-Carrier type on a support, comprising first suction means able, during use, to retain the electronic component (1) and defining a first gripping area (111) for the electronic component (1), second suction means (122) able, during use, to retain a sheet (2) of welding material and defining a second gripping area (121), the second suction means (122) are disposed outside the first gripping area (111) of the electronic component (1), and welding means (130) of the sheet (2) of welding material, able, during use, to deliver an electrical impulse for melting the sheet (2) of welding material. The first gripping area (111) of the electronic component (1) and the second gripping area (121) of the sheet (2) of welding material are arranged on different and parallel planes, and the second suction means are movable between a gripping position (GP), retaining the sheet (2) of welding material spaced from the electronic component (1), and a welding position (WP), retaining the sheet (2) of welding material at the support and in contact with the electronic component (1) held by the first suction means during the delivery of the electrical impulse from the welding means (130).