Configurable Via-Layer Circuits for FIFO and Deserializer Reuse
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit devices require multiple photomasks for different applications, leading to increased manufacturing costs and inefficiencies due to the need for unique circuitry and fabrication steps for each functionality, which limits their configurability and reusability.
Innovation Solution
A via layer is used to connect components between layers of the integrated circuit device, allowing for selective configuration of via sites to create interconnections for different applications, such as FIFO or deserializer circuits, using a single set of circuit layers and reducing the need for multiple photomasks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple photomasks are used for different applications, then manufacturing precision and application-specific functionality are improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent implements a single integrated circuit device that can be configured to perform multiple different applications (FIFO circuit, deserializer circuit, or other applications) through selective via connections. The same basic circuit layers and components are reused across different applications, with the via layer serving as a universal interconnection system that can be programmed to create different circuit functionalities without requiring separate photomasks for each application.
2Reliability
If unique circuitry is designed for each application, then application performance is improved, but manufacturing cost and fabrication complexity increase
Solution Approach 1:
The patent uses a universal circuit architecture with shared components (latches, multiplexers, logic gates) that can be configured through via connections to achieve different application-specific performances. The same physical components serve multiple functions depending on how the via layer interconnects them, eliminating the need for separate fabrication processes for each application while maintaining optimized performance for each specific use case.
3Adaptability or versatility
If multiple application-specific circuits are produced, then functionality coverage is improved, but silicon area and manufacturing cost increase
Solution Approach 1:
The patent merges multiple application-specific circuits into a single integrated circuit device by using shared components and a programmable via layer for interconnection. Instead of having separate physical circuits for FIFO and deserializer functions, the patent combines them into one device where the same latches, multiplexers, and logic gates are reused across different applications through selective via connections, thereby reducing total silicon area while maintaining full functionality coverage.
Data Source
AI summary
An integrated circuit device with a single via layer, in which the via layer includes selectable via sites and/or jumpers. The selectable via sites and/or placement of jumpers may be used to configure and interconnect components and circuitry between distinct layers of multilayer circuits. In some implementations, selectively enabling via sites, such as by filling via opening and/or using jumpers, may form a deserializer circuit with a first via configuration or a first-in first-out (FIFO) circuit with a second via configuration.