Conformable Test Fixture Head for Lid-Less IC Packages
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Solution Overview
Problem
Conventional IC package testing systems are inefficient and prone to damaging lid-less IC packages due to their inability to accommodate varying die heights and apply uniform force, leading to increased manufacturing costs and potential damage during testing.
Innovation Solution
The IC package testing system employs a conformable test fixture head with independently movable pushers and force generating members made from high thermal conductivity materials, allowing for flexible force application and accommodation of different die heights, reducing the risk of damage and enabling efficient electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional testing equipment with rigid test fixture head surface is used, then testing can be performed on IC packages, but the equipment cannot accommodate differences in die height and applies unwanted stress to the package
Solution Approach 1:
The test fixture head is divided into multiple independently movable pushers that can be individually positioned to contact different dies at their respective heights, allowing each pusher to apply force independently without transmitting stress to adjacent dies or the package substrate
Solution Approach 2:
The pushers are made independently movable rather than fixed to a rigid surface, allowing them to dynamically adjust their positions and apply force only to the tops of the dies without transmitting stress to the package body, thereby accommodating height variations while preventing damage
2Manufacturing precision
If custom high tolerance and sophisticated testing equipment is made to accommodate lid-less IC packages, then testing accuracy can be improved, but capital costs for specialized equipment increase significantly
Solution Approach 1:
The test fixture head with independently movable pushers is designed to accommodate multiple die configurations and package types on a single platform, eliminating the need for multiple specialized fixtures and reducing capital expenditures while maintaining testing precision across different IC package varieties
3Productivity
If conventional testing systems are used, then testing can be performed, but testing becomes more time consuming and difficult as IC packages become larger and more complex
Solution Approach 1:
Each pusher is designed to contact only the local top surface of individual dies, applying force precisely where needed without affecting other areas of the package, thereby simplifying the testing process for complex multi-die packages while maintaining high testing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective testing of IC packages with reduced risk of damage, accommodating various die configurations without the need for costly reconfiguration, thereby minimizing capital expenditures and downtime, while ensuring reliable electrical connections and efficient heat dissipation.
Implementation Method 1
The plurality of pushers and the plurality of force generating members are fabricated from a material having high thermal conductivity
Data Source
AI summary
Integrated (IC) package testing systems and methods for testing an IC package are provided herein that accommodate IC packages having different die heights. In one example, the IC package testing system includes a test fixture base, a socket, and a test fixture head. The socket is disposed on the test fixture base and configured to receive an IC package for testing. The test fixture head is movable towards and away from the base. The test fixture head includes a base plate and a plurality of independently movable pushers. The plurality of pushers are configured to engage the IC package disposed the socket.