Conformal Heat Spreader for 3D Multichip Die Thermal Bottlenecks
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Solution Overview
Problem
Thermal management of multichip composite devices with 3D stacked dies faces challenges due to difficulty in heat removal, leading to potential device damage or performance throttling, especially with thin top dies that hinder effective heat transfer.
Innovation Solution
A conformal heat spreading layer with high thermal conductivity, such as copper, aluminum, silver, diamond, graphene, or hexagonal boron nitride, is applied over the top IC dies and base die to create an efficient thermal pathway for heat removal, enhancing thermal performance and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thin top dies are used in multichip composite devices, then device integration and power efficiency are improved, but heat transfer capability deteriorates
Solution Approach 1:
The patent applies composite materials by depositing a conformal heat spreading layer comprising metal particles (such as aluminum, copper, or silver) embedded within a dielectric material matrix. This composite structure combines the thermal conductivity benefits of metals with the electrical insulation and mechanical flexibility of dielectric materials, enabling effective heat spreading from thin top dies without compromising device integration.
Solution Approach 2:
The conformal heat spreading layer is applied specifically to regions requiring enhanced heat management, such as areas directly beneath high-power top dies or in thermal bottleneck zones. This localized application optimizes heat transfer capability where needed while maintaining overall device integration benefits of thin top dies.
2Device complexity
If conventional heat removal methods are used, then device structure simplicity is maintained, but thermal performance deteriorates leading to device damage or throttling
Solution Approach 1:
The conformal heat spreading layer acts as an intermediary between the thin top dies and the heat sink or thermal management system. This intermediate layer with high thermal conductivity facilitates efficient heat transfer from the dies to the cooling structure, preventing thermal runaway and device damage while maintaining structural simplicity.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the device structure by incorporating metal particles with high thermal conductivity into the heat spreading layer. This parameter change enables effective heat removal without fundamentally altering the basic device architecture, thus maintaining structural simplicity while improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conformal heat spreading layer effectively increases thermal conductivity, improving heat spreading and removal from top dies and the multichip composite device, preventing damage and throttling, and maintaining performance.
Implementation Method 1
the conformal layer comprises a greater thermal conductivity than the inorganic dielectric material
Data Source
AI summary
Microelectronic devices, assemblies, and systems include a multichip composite device having one or more integrated circuit dies bonded to a base die, a conformal thermal heat spreading layer on the top and sidewalls of the integrated circuit dies, and an inorganic dielectric material on a portion of the conformal thermal heat spreading layer, laterally adjacent the integrated circuit dies, and over the base die. The conformal thermal heat spreading layer includes a high thermal conductivity material to provide a thermal pathway for the integrated circuit dies during operation.