Conformal Shield for Semiconductor Package EMI Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional EMI shielding methods for semiconductor package devices, such as using electrically conductive casings, increase the device size and are not suitable for high-density integrated circuits, leading to space and cost constraints.
Innovation Solution
A semiconductor package device design incorporating a carrier with a compartment shield and a conformal shield, where the compartment shield divides the carrier into areas and the conformal shield is formed on the package body to reduce electromagnetic emissions without the need for a bulky shielding lid, using conductive materials like Al, Cu, or stainless steel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrically conductive casing is used for EMI shielding, then electromagnetic interference is reduced, but the device size increases
Solution Approach 1:
The shielding structure is divided into multiple segments: a compartment shield that divides the carrier into first and second areas, and a conformal shield that covers specific surfaces. This segmentation allows shielding to be applied only where needed rather than using a complete enclosing casing, reducing overall device volume while maintaining EMI protection for critical components
Solution Approach 2:
The conformal shield is applied selectively to the first portion of the package body (covering the first area with electrical components) while leaving the second portion (antenna area) exposed. This local application of shielding provides EMI protection for sensitive electrical components without unnecessarily increasing device size or blocking antenna functionality
2Object-generated harmful factors
If a shielding lid is added to reduce EMI, then electromagnetic emissions are reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The conformal shield is integrated directly into the package body structure, forming a unified component rather than being added as a separate shielding lid. This merging of the shield with the package body eliminates the need for separate shielding components and their associated handling and assembly steps, reducing manufacturing complexity while maintaining EMI reduction functionality
Solution Approach 2:
The conformal shield is formed as an integral part of the package body through a conformal deposition process, allowing the structure to self-form the shielding layer during manufacturing. This eliminates the need for separate shielding components that would require handling, positioning, and attachment operations, thereby reducing manufacturing complexity and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces electromagnetic interference (EMI) while maintaining a compact size and minimizing manufacturing costs by integrating shielding directly into the package structure, avoiding the bulkiness and handling costs associated with separate shielding lids.
Implementation Method 1
When electromagnetic emissions from an interior of the package strike an inner surface of the casing, at least a portion of these emissions can be electrically shorted, thereby reducing the level of emissions that can pass through the casing and adversely affect neighboring semiconductor devices.
Data Source
AI summary
The present disclosure provides a semiconductor package device and a method for manufacturing the same. In embodiments of the present disclosure, a semiconductor package device includes a carrier, a first antenna, a second antenna, a package body and a first shield. The carrier includes an antenna area and a component area. The first antenna is formed on the antenna area. The second antenna extends from the antenna area and over the first antenna. The second antenna is electrically connected to the first antenna. The package body includes a first portion covering the component area and a second portion covering the antenna area. The first shield is conformally formed on the first portion of the package body and exposes the second portion of package body.