Conformal Shielding Layer for Chip Package EMI
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Solution Overview
Problem
Conventional EMI shielding solutions for small-sized, densely packaged electronic devices operating at high frequencies are costly and inefficient, often resulting in incomplete coverage due to orthogonal corners and edges, which degrade the reliability and effectiveness of the shielding.
Innovation Solution
A chip package design featuring a substrate with a molding compound and a conformally applied shielding layer, where the top edges of the molding compound are blunted or rounded through a grinding process to ensure complete coverage and prevent crevices, using conductive materials like aluminum or copper deposited via spraying or sputtering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional metal plates and conductive gaskets are used for EMI shielding, then EMI protection is provided, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive conventional EMI shielding materials (metal plates and conductive gaskets) with a cost-effective conformal coating process that applies conductive material directly to the molding compound surface, significantly reducing manufacturing costs while maintaining EMI shielding effectiveness
Solution Approach 2:
The patent substitutes mechanical assembly of separate metal shielding components with a conformal coating process that deposits conductive material directly onto the molding compound, simplifying the manufacturing process and reducing costs
2Ease of manufacture
If orthogonal corners and edges are used in molding compound, then manufacturing is simplified, but shielding coverage becomes incomplete
Solution Approach 1:
The patent modifies the molding compound geometry by rounding or blunting the orthogonal corners and edges, creating curved surfaces that enable complete conformal coverage by the shielding layer, eliminating crevices and ensuring continuous EMI protection without compromising manufacturing simplicity
3Ease of manufacture
If shielding layer is applied over orthogonal edges, then application process is simplified, but crevices form reducing shielding effectiveness
Solution Approach 1:
The patent rounds or blunts the orthogonal edges of the molding compound before applying the shielding layer, creating curved surfaces that allow the conformal coating process to deposit uniform shielding material without forming crevices, thereby achieving complete and consistent coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances EMI shielding efficacy and package reliability by ensuring uniform coverage of the shielding layer, reducing leakage at corners, and improving electrical performance, making it suitable for high-frequency devices like radio frequency packages.
Implementation Method 1
the shielding layer and the connectors are formed from a conductive material by a spraying process
Implementation Method 2
the shielding layer and the connectors are formed from a conductive material by a spraying process, a sputtering process or a plating process
Implementation Method 3
the shielding layer and the connectors are formed from a conductive material by a spraying process, a sputtering process or a plating process
Implementation Method 4
The grinding process may comprise an oblique disc grinding process or a rounding grinding process
Data Source
AI summary
A chip package including a shielding layer conformally covering the underlying molding compound for is provided. The shielding layer can smoothly cover the molding compound and over the rounded or blunted, top edges of the molding compound, which provides better electromagnetic interferences shielding and better shielding performance.