Conforming Test Socket for Curved IC Devices
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Solution Overview
Problem
Conventional device testers deform IC devices due to undue pressure, especially when testing curved devices with thinner substrates, as they are designed assuming flat profiles, leading to uneven and permanent deformation during temperature testing.
Innovation Solution
A thermal control unit with a test socket assembly that conforms to the device's profile, using a pedestal assembly with a heat-conductive pedestal, temperature-control fluid circulation, and a controllable force distributor to maintain set-point temperature and distribute forces evenly, preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional device testers with flat profiles are used to test curved IC devices, then the testing process can be performed, but undue pressure is exerted on the curved device causing deformation
Solution Approach 1:
The pedestal is made compliant rather than rigid, allowing it to dynamically adapt its shape to match the curved profile of the IC device under test. This compliance enables the testing process to proceed while the pedestal continuously conforms to the device geometry, eliminating undue pressure points that would cause deformation.
Solution Approach 2:
The mechanical properties of the pedestal are changed from rigid to compliant, allowing it to deform elastically and match the curved profile of the IC device. This parameter change enables the pedestal to accommodate various device curvatures without exerting excessive localized pressure.
2Device complexity
If flat pedestals and substrate pushers are used, then the tester structure is simple, but uneven pressure is exerted on curved devices leading to permanent deformation
Solution Approach 1:
The pedestal utilizes a flexible, compliant structure that can bend and conform to the curved profile of the IC device. This flexible design replaces the traditional rigid flat pedestal, allowing even pressure distribution across the device surface without causing localized stress concentrations that lead to deformation.
3Device complexity
If the pedestal contacts only the die and substrate pusher contacts only the substrate perimeter, then the tester design is simplified, but the unsupported substrate surface becomes uneven after testing
Solution Approach 1:
The compliant pedestal serves multiple functions simultaneously: it provides mechanical support for the die, distributes pressure evenly across the substrate surface, and maintains contact with the device throughout the testing process. This multi-functionality eliminates the need for separate support mechanisms while preventing substrate deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes deformation of IC devices during testing, ensuring accurate temperature control and maintaining the device's original specifications, reducing physical damage and improving contact alignment during subsequent assembly.
Implementation Method 1
a heat-conductive pedestal, temperature-control fluid circulation
Implementation Method 2
spring-loaded suspension support pins
Data Source
AI summary
A thermal control unit used to maintain a set point temperature on an integrated circuit device under test, has at least one cooling plate configured to facilitate the testing of integrated circuits where the device under test requires efficient cooling.