Connectable Package Extender for Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing semiconductor device packaging designs face challenges in heat dissipation, particularly in high-power applications, where substantial additional area and expense are required for effective heat sink designs, leading to potential device failure and degraded performance.
Innovation Solution
A semiconductor packaging system that includes a connectable package extender with interlocking surface features, allowing for secure attachment to the device package, and an extension portion configured to dissipate heat away from the package, which can be customized for various applications using thermally conductive or insulating materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If known heat sink designs are used to dissipate heat, then heat dissipation is improved, but area consumption and cost increase substantially
Solution Approach 1:
The invention divides the heat dissipation function into two separate components: the semiconductor device package and a detachable package extender. The extender is a separate module that attaches to the package, allowing heat dissipation capabilities to be added without increasing the base package area. This segmentation enables the package to maintain its original footprint while providing optional heat dissipation enhancement.
Solution Approach 2:
The package extender utilizes the vertical dimension by extending downward from the base package. Instead of expanding the heat dissipation area in the horizontal plane (which would increase package area), the solution adds thermal mass and heat dissipation structures in the vertical direction, effectively using the Z-axis to resolve the area constraint.
2Temperature
If known heat sink designs are used to dissipate heat, then heat dissipation is improved, but manufacturing cost increases substantially
Solution Approach 1:
By separating the heat dissipation function into a detachable extender module, the invention allows manufacturers to produce the base package and the extender separately using optimized processes for each. This segmentation enables cost-effective manufacturing where the extender can be produced in high volumes as a standalone component and only assembled with packages that require heat dissipation, reducing overall manufacturing costs.
Solution Approach 2:
The package extender is designed as a universal component that can attach to multiple different package types through standardized attachment features. This multi-functionality allows a single extender design to serve multiple applications, reducing development and tooling costs while simplifying the manufacturing supply chain.
3Temperature
If heat dissipation structures are integrated into the package, then heat dissipation is improved, but package design complexity increases
Solution Approach 1:
The invention segregates the heat dissipation complexity into a separate extender module, leaving the base package design simple and focused on its core semiconductor housing function. The thermal management complexity is contained within the extender, which can be independently designed and optimized without complicating the base package structure.
Solution Approach 2:
The detachable nature of the package extender introduces dynamic configurability to the system. Users can attach or remove the extender based on specific application requirements, allowing the package design to adapt to different thermal management needs without being permanently committed to a complex integrated structure. This dynamic approach simplifies the base package design while providing flexibility for thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient heat dissipation or electromagnetic interference reduction at minimal expense and area consumption, decoupling package design considerations from heat dissipation requirements, and allowing for customization in different applications.
Implementation Method 1
The extension portion may be configured to dissipate heat away from the semiconductor device package when the package extender is secured to the semiconductor device package
Implementation Method 2
The extension portion configured to dissipate heat away from the package
Implementation Method 3
The surface feature is configured to interlock with a surface feature of a connectable package extender so as to secure the package extender to the semiconductor device package
Data Source
AI summary
A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure encapsulating and electrically insulating the semiconductor chip. Two or more electrical conductors that are each electrically connected to one of the terminals extend to an outer surface of the protective structure. A first surface feature is on an exterior surface of the semiconductor device package. The system further includes a connectable package extender having a second surface feature configured to interlock with the first surface feature when the first surface feature is mated with the second surface feature so as to secure the package extender to the semiconductor device package. An extension portion adjoins and extends away from the exterior surface of the semiconductor device package when the package extender is secured to the semiconductor device package.