Connector Cavity Absorber Layout for Crosstalk and Resonance
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Solution Overview
Problem
High density, high speed connectors experience electrical interference and cavity resonance between adjacent circuit boards, which hinders performance.
Innovation Solution
Incorporating electromagnetic absorber members made of high dielectric or magnetic loss materials between circuit boards to absorb unwanted electromagnetic energy and reduce resonance in cavities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal shields are placed between circuit boards to reduce electrical interference, then electrical performance is improved, but cavity resonance increases
Solution Approach 1:
The patent introduces an electromagnetic absorber as an intermediary material placed between circuit boards alongside metal shields. This absorber material mediates the electromagnetic environment by absorbing unwanted signals and reducing cavity resonance, while the metal shields continue to provide shielding against electrical interference. The intermediary absorber material resolves the contradiction by addressing the resonance issue without compromising the shielding function.
Solution Approach 2:
The patent employs a composite approach by combining metal shield materials with electromagnetic absorber materials in the same interconnection system. The metal provides shielding functionality while the absorber material (with different electromagnetic properties) provides resonance reduction. This composite material strategy allows both functions to coexist and resolve the technical contradiction between improved electrical performance and reduced cavity resonance.
2Area of stationary object
If circuit boards are placed close together to achieve high density, then space utilization is improved, but electrical interference between boards increases
Solution Approach 1:
The electromagnetic absorber acts as an intermediary substance filling the cavities between closely spaced circuit boards. This absorber material mediates the electromagnetic interaction between adjacent boards by absorbing stray signals and reducing cross-talk, enabling high-density placement while maintaining electrical performance.
Solution Approach 2:
The patent converts the harmful electromagnetic energy that would cause interference into beneficial absorbed energy. The electromagnetic absorber materials transform the harmful cross-talk and resonance into absorbed energy that does not interfere with signal transmission, allowing close board spacing without performance degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances electrical performance by reducing resonance and improving crosstalk, thereby optimizing signal transmission in high density connectors.
Implementation Method 1
Electromagnetic absorber members made of high dielectric or magnetic loss materials between circuit boards to absorb unwanted electromagnetic energy and reduce resonance in cavities
Data Source
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AI summary
An electrical interconnection system (10). The electrical interconnection system (10) includes a housing (20) with at least one circuit board (22) positioned in the housing. At least one cavity (40) is positioned proximate the at least one circuit board. At least one electromagnetic absorber member (44) is positioned in the at least one cavity. The at least one electromagnetic absorber member reduces resonance present in the at least one cavity.