Magnetic/Electric Field Screening TRIZ Cases
- Semiconductor package device and method of manufacturing the same
Vertical via and redistribution layer packaging replaces costly interposers, improving 2.5D chip integration flexibility and productivity.
- Liquid Cooling Tray Connector Assembly With Spring-Loaded Contact
Spring-loaded liquid cooling trays maintain direct contact with connector heat sources, improving dissipation and simplifying assembly.
- Connector Cavity Absorber Layout for Crosstalk and Resonance
Electromagnetic absorber members placed between circuit boards suppress cavity resonance and crosstalk in high-density connectors.
- Flat Wire Harness Layout With Magnetic Core Noise Shielding
A magnetic core on a flat wire harness base absorbs electromagnetic noise while metal foil shields signal wires and simplifies assembly.
- Ferrite Powder Composition for Flexible GHz Absorbing Sheets
Controlled ferrite particle size and density enable high filler loading with lower melt viscosity, better dispersion, and flexible GHz absorbing sheets.
- Shielded Module Layout With Low-Dielectric Layer for Parasitic Capacitance
A low-dielectric member between shield films cuts parasitic capacitance without increasing module height, helping prevent shielding-related malfunctions.
- Vehicle Lamp Switching Converter Layout for Noise Shielding
A conductive cover and segmented substrate layout suppress switching-converter noise in vehicle lamps while shortening wiring and reducing board size.
- Interposer Connector Assembly for Dense High-Speed Module Mating
Compressible socket contacts and a selectable board or cable interposer increase module contact density while shortening signal paths for high-speed links.
- Capacitive Voltage-Dividing Core Layout for Interference-Resistant Sampling
Radially spaced shielding capacitive screens suppress external interference while preserving voltage sharing for more accurate high-voltage sampling.