Shielded Module Layout With Low-Dielectric Layer for Parasitic Capacitance
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Solution Overview
Problem
Conventional modules with shielded components experience parasitic capacitance due to potential differences between shield films, which can cause malfunctions, and increasing the distance between these films to reduce capacitance hinders module height reduction.
Innovation Solution
Incorporating a low dielectric member with a lower dielectric constant than the sealing resin between the first and second shield films, and forming the second shield film on the low dielectric member, while maintaining the module's height by using a tapered shape and enhancing adhesion through nitrogen functional groups.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the distance between the first shield film and the second shield film is increased to reduce parasitic capacitance, then parasitic capacitance is reduced, but the height of the module increases
Solution Approach 1:
The patent changes the dielectric constant parameter of the material between the shield films by introducing a low dielectric constant member (εr=2.6) instead of using sealing resin (εr=3.8). This parameter change reduces parasitic capacitance without requiring increased distance between shield films, thus maintaining compact module height while improving electrical performance
Solution Approach 2:
The patent employs a composite structure combining sealing resin and low dielectric constant member in specific regions. The low dielectric constant member is positioned between the shield films where parasitic capacitance occurs, while the sealing resin provides overall encapsulation. This composite approach targets the specific problem area without compromising overall sealing functionality
2Reliability
If a low dielectric member is added between the shield films to reduce parasitic capacitance, then electromagnetic shielding performance is improved, but the device complexity increases
Solution Approach 1:
The low dielectric constant member serves multiple functions: it reduces parasitic capacitance between shield films, maintains the sealing structure integrity, and provides electromagnetic shielding support. By combining these functions into a single component, the patent avoids adding unnecessary structural complexity while achieving improved electromagnetic shielding performance
Solution Approach 2:
The low dielectric constant member acts as an intermediary between the first and second shield films, providing electrical isolation with reduced capacitance. This intermediary component is strategically positioned only where needed for capacitance reduction, rather than requiring complete structural redesign of the module
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces parasitic capacitance effectively without increasing the module's height, thereby preventing malfunctions and ensuring reliable electromagnetic interference shielding.
Implementation Method 1
a low dielectric member arranged between the first shield film and the second shield film and having a dielectric constant lower than a dielectric constant of the sealing resin
Data Source
AI summary
It is to provide to a module and a method of manufacturing the module in which parasitic capacitance generated between two shield films is reduced without hindering reduction in height of a module. The module includes, a substrate, a component mounted on an upper surface that is one main surface of the substrate, a first shield film provided on an upper surface of the component, sealing resin provided on an upper surface of the substrate so as to seal the component, a second shield film provided on an upper surface or an upper side of the sealing resin, and a low dielectric member arranged between the first shield film and the second shield film and having a dielectric constant lower than a dielectric constant of the sealing resin.