Electrical Connector With Integrated Solder Ball Terminals

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Solution Overview

Problem

Existing electrical connectors with chip modules and printed circuit boards have complex structures and require multiple manufacturing steps and reflow processes, making them cumbersome and inefficient.

Innovation Solution

An electrical connector with an insulating housing and integrally molded conductive terminals, where the terminals have both first and second soldering portions for direct soldering to the chip module and printed circuit board, respectively, simplifying the structure and manufacturing process by reducing the number of reflow steps and incorporating a detachable cover for improved heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional electrical connector structure with separate terminals and solder balls is used, then reliable electrical connection is achieved, but device complexity and manufacturing steps increase

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidconnector structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the terminal body and solder balls into a single integrated terminal structure. The terminal includes a body portion with first solder balls at one end and second solder balls at the other end, eliminating the need for separate terminal components and reducing assembly steps while maintaining reliable electrical connections.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated terminal serves multiple functions simultaneously: it provides electrical connection, mechanical support, and soldering interfaces on both ends. The single terminal structure replaces multiple separate components, reducing device complexity while maintaining all necessary functions for reliable connection between chip module and PCB.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If traditional multi-step reflow process is used, then proper soldering is achieved, but manufacturing time and productivity are reduced

Engineering Contradiction:
Improvesoldering qualityVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges multiple soldering operations into a single reflow process. By positioning both first and second solder balls on the integrated terminal, the chip module and PCB can be soldered simultaneously in one reflow step, eliminating the need for multiple sequential reflow processes and improving manufacturing efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The terminal is pre-configured with solder balls at both ends before assembly, allowing both soldering operations to be prepared in advance. This preliminary arrangement enables simultaneous soldering of both interfaces during a single reflow process, reducing total manufacturing time while maintaining soldering quality.

Inventive Principle:
Principle #10Preliminary action

3Length of moving object

If connector height is reduced, then compact design is achieved, but heat dissipation capability may be compromised

Engineering Contradiction:
Improveconnector heightVSAvoidheat dissipation
Core Design Contradiction:
Length of moving objectVSTemperature

Solution Approach 1:

The patent shifts heat dissipation focus from vertical to horizontal dimensions. The insulating housing includes heat dissipation fins extending laterally from the body, providing large surface area for heat dissipation without increasing connector height. This allows compact vertical profile while maintaining effective thermal management through lateral fin structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the height and complexity of the connector, streamlines the manufacturing process, and efficiently secures both the chip module and printed circuit board with a single reflow step, while enhancing heat dissipation through a plate configuration with locking arms.

Implementation Method 1

The terminals (30) are made from a solder ball, which has a 95.6 percentage of tin

Methodology Applied
Scientific EffectSolidification: Freezing

Implementation Method 2

The first soldering portions (31) are used for soldering to the chip module (50), the second soldering portions (32) are used for soldering to the printed circuit board (60)

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS10201096B2Electrical connector with terminals made from soldering balls
Publication Date: 2019.02.05 FOXCONN INTERCONNECT TECHNOLOGY LTD
  • US10201096B2 patent drawing
  • US10201096B2 patent drawing
  • US10201096B2 patent drawing

AI summary

An electrical connector used for connecting an chip module to a printed circuit board includes an insulating housing, a number of terminals and a cover. The insulating housing includes a body portion. The terminals are insert molded in the body portion. The body portion includes an upper face and a lower face. Each of the terminals includes a first soldering portion extending upwardly beyond the upper face and a second soldering portion extending downwardly beyond the lower face. The cover covers the insulating housing. The electrical connector has a simple structure and a simple manufacturing process.