Electrical Connector Shielding via Lateral Grounding Path
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Solution Overview
Problem
The increasing transfer rates and dense conductive terminal arrangements in USB3.1 Super Speed+ interfaces lead to capacitive coupling and impedance mismatch issues, reducing signal stability and quality in electrical connector assemblies.
Innovation Solution
An electrical connector assembly design where the metallic plate is directly electrically conducted to a grounding circuit exposed on the lateral surface of the circuit board, enhancing shielding and reducing crosstalk interference by providing a shorter grounding path and improved structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metallic plate is provided between terminals as a shield and connected to grounding pads on upper and lower surfaces of the circuit board, then shielding effect is provided, but the grounding path is long and performance is limited
Solution Approach 1:
The patent exposes the grounding circuit from the lateral surface of the circuit board instead of using only upper and lower surface grounding pads. This dimensional change creates a shorter grounding path from the metallic plate to the grounding circuit, improving shielding performance while reducing the length of the grounding path.
2Productivity
If the number of conductive terminals is increased for higher transfer rates, then storage capacity and transfer rate are improved, but capacitive coupling and impedance mismatch increase, reducing signal stability
Solution Approach 1:
The metallic plate divides the terminals into two different areas, segmenting the terminal arrangement. This segmentation reduces capacitive coupling between terminals by creating spatial separation and shielding zones, thereby maintaining signal stability even with increased terminal density for higher transfer rates.
3Weight of moving object
If the electrical connector assembly is designed to be light, thin, and short, then portability and convenience are improved, but shielding and grounding effectiveness may be compromised
Solution Approach 1:
By exposing the grounding circuit from the lateral surface of the circuit board, the patent achieves effective grounding and shielding within a compact form factor. This dimensional approach allows the grounding path to extend laterally rather than vertically through thick PCB layers, maintaining shielding effectiveness while keeping the assembly thin and lightweight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively improves the shielding and grounding effects, reducing crosstalk interference and enhancing the structural strength of the electrical connector assembly, while maintaining a lightweight, thin, and convenient design.
Implementation Method 1
a metallic plate is provided between terminals of the electrical connector as a shield for separating the terminals on two different areas
Implementation Method 2
the metallic plate is directly electrically conducted to the grounding circuit on the lateral surface
Data Source
AI summary
An electrical connector assembly including an electrical connector and a circuit board is provided. The electrical connector has a metallic plate and a plurality of terminals. The metallic plate separates the terminals into two different areas. The metallic plate has a first lateral surface. The circuit board is assembled to the electrical connector. The circuit board has a plurality of pads, a second lateral surface, and top and bottom surfaces opposite to each other. The pads are disposed on the top and bottom surfaces respectively. The second lateral surface is boarded between the top and bottom surfaces. The circuit board further includes at least one grounding circuit exposed from the second lateral surface and facing toward the first lateral surface. The metallic plate is electrically conducted to the grounding circuit by the first lateral surface when the circuit board is assembled to the electrical connector.