Connector Partition Heat Conduction Block for Photoelectric Chips
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Solution Overview
Problem
Small Form Factor (SFF) connectors with photoelectric conversion functions face heat dissipation issues, leading to increased temperatures and degraded performance of photoelectric chips.
Innovation Solution
A connector design featuring a cage with partition devices and a heat dissipation system, including a heat conduction block and pipe, which absorbs and transfers heat generated by photoelectric chips to an external radiator, ensuring efficient temperature management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If photoelectric chips are used for signal conversion, then photoelectric conversion function is achieved, but heat is generated increasing temperature and deteriorating performance
Solution Approach 1:
A heat conduction block is introduced as an intermediary component between the photoelectric chip and the external environment. The block directly contacts the chip's heat generation area and transfers heat to heat conduction pipes, serving as a mediator to resolve the temperature issue without affecting the chip's photoelectric conversion function
Solution Approach 2:
The heat dissipation system is extracted as a separate functional module from the connector body. Heat conduction pipes extend from the heat conduction block to the rear of the connector, carrying heat away from the photoelectric chip area through a dedicated thermal management pathway
2Productivity
If multiple plugs are received in array, then connectivity is improved, but heat accumulation increases due to proximity
Solution Approach 1:
The connector is segmented into multiple independent plug receiving units arranged in a 2x2 array. Each unit has its own heat conduction block and heat dissipation pathway, allowing heat from each plug to be managed independently, preventing heat accumulation while maintaining high connectivity capacity
3Temperature
If heat dissipation structure is added, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat conduction block is merged with the partition structure of the connector, integrating thermal management functionality into the existing mechanical framework. The partition devices serve dual purposes: structural separation of plugs and heat conduction pathways, reducing overall device complexity while maintaining effective temperature control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the temperature of photoelectric chips, maintaining stable electrical performance and improving photoelectric conversion efficiency.
Implementation Method 1
a heat conduction block positioned between the upper partition plate and the lower partition plate, and a heat conduction pipe that contacts the heat conduction block and extends beyond a rear wall of the cage
Data Source
AI summary
A connector is provided and includes a cage, a plurality of partition devices, and a heat dissipation device. The cage includes a plurality of plug receiving units that are arranged in at least a two columns by two rows arrangement. The plurality of partition devices include an upper partition plate and a lower partition plate and is positioned between two adjacent plug receiving units of the plurality of plug receiving units. The heat dissipation device includes a heat conduction block positioned between the upper partition plate and the lower partition plate, and a heat conduction pipe that contacts the heat conduction block and extends beyond a rear wall of the cage.