Coupling Light Guides TRIZ Cases

Segmented positioning devices enable precise in-plane alignment of fiber terminators without disrupting adjacent modules.

A tilted optoelectronic component aligns with a shallow coupling angle to enable direct light beam transfer.

Threadable engagement joins a ferrule assembly to a holder, resolving handling difficulties at external work sites.

Vertical facet coupling eliminates out-of-plane reflections and reduces path divergence, lowering optical loss in multi-chip modules.

A waveguide photodiode integrates a lightly doped n-type buffer layer to lower parasitic capacitance on the semiconductor substrate.

An optical connector uses a lens to bridge waveguides, eliminating compressive force and suppressing back reflection.

Interchangeable adjusting plates enable a single optical connector receptacle to support different specifications, reducing manufacturing complexity and cost.

Hierarchical keying segments alignment into coarse and fine stages, reducing angular offset between polarization axes while managing manufacturing complexity.

Segmented directing-prisms route different wavelengths to a combining-prism, reducing enclosure footprint while maintaining high coupling efficiency.

Armored furcation tube protects spliced optical fibers, reducing signal loss and reflectance for reliable warehouse connections.

Segmenting the submount with local quality resolves solder melting and fiber degradation by balancing thermal insulation and dissipation.

Internal threads trap back-reflected light to prevent heat buildup and damage in high-power fiber laser systems.

Merging discrete dies into one package cuts serdes size by 25% and power by 22%.

Flexible blades enable tool-free assembly of optical contacts, resolving size and reliability trade-offs.

A connector system aligns multi-core and single-core fibers using guide pins and holes within an optical connection member.

Tapered waveguides on an interposer chip reduce vertical mode size, enabling efficient coupling between fiber arrays and thin photonic chip waveguides.

A star coupler and tunable laser steer light through passive grating couplers, eliminating active phase-shifters to reduce power consumption.

Side-view fluorescent light observation enables precise waveguide alignment without adding propagation loss.

Aligning an auto-collimator with a reference mirror ensures precise optical axis positioning, reducing alignment time and improving coupling efficiency.

A mode converter uniformly couples optical power from single-mode to multi-mode signals using a scrambler with controlled mechanical features.

A sealed inlet device secures optical fiber cables using a unibody housing and strain relief members for telecommunications enclosures.

Laser etching creates grooves in hexagonal claddings to mechanically bind nested fibers, eliminating air bubbles and signal attenuation from high-power signals.

Thermal contact between the OIC and a stabilizing brace minimizes center wavelength drift caused by temperature variations.

Angular trenches with mirrored facets enable compact optical splitting, resolving bulkiness and integration constraints in silicon photonics.

A projection display uses a waveguide assembly with diffraction regions to expand an input pupil in orthogonal dimensions.

Compliant flexible arms in optical ferrules compensate for manufacturing tolerances to maintain alignment accuracy.

Ferrule with light-transmittable intermediary portion aligns optical transmission lines, eliminating time-consuming grinding and reducing damage risk.

A spring-biased shutter configuration protects fiber optic connector ports from dust intrusion using peripheral regions that oppose undercut portions.

A planar optical waveguide uses a photoresist core with higher refractive index than substrate and cladding layers to confine light via total internal reflection.

Segmented stiffener rings enable optical fiber routing through co-packaged optics while maintaining coplanarity and warpage performance.

Passive alignment structure uses external optical signals to position fiber blocks on photonic integrated circuits without powering active devices.

Inclined emission end surface directs diffracted light from a grating coupler substrate, avoiding upper-surface spatial obstacles for flexible mounting.

Partition plates position a heat conduction block between plug units, transferring chip heat through pipes to reduce temperature.

Dual cylindrical lenses expand and condense optical signals to replace custom arrays, reducing manufacturing costs while maintaining coupling efficiency.

A wavelength converter stabilizes light coupling efficiency by using a support structure that mitigates thermal stress from mismatched expansion coefficients.

An asymmetrical taper transition region guides light between waveguides with different heights by gradually reducing width.

A shaped capillary structure with an inner periphery matching the fiber bundle geometry eliminates interstitial spaces that cause twist, crossover, and jamming.

A signal transmission cable uses optical fibers to carry HDMI data between electro-optic conversion modules at each connector end.

Silicon nitride waveguides on a hybrid glass interposer reduce propagation loss and power consumption for ultra-high speed data transmission.

Integrating adapter and connector features into one unitary wall reduces part count and assembly complexity while maintaining environmental sealing.

An analog optical interconnect transmits signals directly between image sensors and processors.

Plate members rise between parallel cages to extract heat from pluggable modules, reducing device size and eliminating resin-based sheet emissions.

A segmented optical fiber bundle structure aligns signal and dummy fibers within a capillary to enable precise multicore connections.

Periodic driving forces eliminate settling time during rapid scanning, enabling faster data acquisition while maintaining measurement precision.

Multi-fiber ferrules with fiber tips under two millimeters reduce contact force via elastic deformation, minimizing power loss from gaps.

An adhesive layer couples aligned waveguides in a semiconductor package, reducing assembly complexity and optical loss.

Inclined fiber ends reflect signals through a dedicated surface to enhance return loss, eliminating complex glass sheets and reducing manufacturing costs.

Curved grating lines shape divergent beams to relax alignment tolerance between InP and silicon photonics chips.

A launch fixture system secures optical fibers and flexible instruments to enable rapid deployment.

A multi-die layered structure uses photonic waveguide bonds to connect PIC dies with substrate waveguides.