Laser Device Fiber Submount Thermal Management
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Solution Overview
Problem
Laser modules using heat insulating materials for fiber submounts face issues with solder melting and optical fiber degradation due to inefficient heat release, leading to alignment problems and reduced reliability.
Innovation Solution
A laser device with a supporting member made from non heat insulating material, where the solder fixation section is spaced apart from the heat releasing member, allowing efficient heat conduction and uniform temperature distribution during solder application and light introduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If heat insulating material is used for fiber submount, then optical fiber protection is improved, but heat release efficiency deteriorates causing solder melting and optical fiber degradation
Solution Approach 1:
The fiber submount is divided into two distinct sections: a first section made of heat insulating material for optical fiber fixation, and a second section made of heat conductive material for heat dissipation. This segmentation allows each section to perform its specialized function without interfering with the other, resolving the contradiction between fiber protection and heat release.
Solution Approach 2:
Different regions of the fiber submount are assigned different thermal properties: the first section has heat insulating characteristics to protect the optical fiber, while the second section has heat conductive characteristics to efficiently dissipate heat from the solder joint. This local differentiation of material properties enables simultaneous achievement of fiber protection and reliable heat management.
2Ease of manufacture
If soldering temperature is increased to melt solder, then solder application is improved, but optical fiber degradation occurs due to excessive heat
Solution Approach 1:
The fiber submount implements local quality differentiation where the first section provides thermal insulation to protect the optical fiber from excessive heat during soldering, while the second section provides thermal conduction to manage heat at the solder joint. This allows soldering to proceed at appropriate temperatures without degrading the optical fiber.
Solution Approach 2:
The fiber submount acts as an intermediary thermal management component between the solder joint and the optical fiber. It mediates the thermal interaction by insulating the fiber from heat while allowing the solder joint to reach necessary temperatures for proper soldering.
3Reliability
If heat conductive material is used for fiber submount, then heat release is improved, but temperature distribution uniformity deteriorates causing non-uniform solder application
Solution Approach 1:
The fiber submount is segmented into distinct thermal zones: a heat insulating first section and a heat conductive second section. This segmentation creates favorable temperature distribution for soldering while maintaining efficient heat release pathways, avoiding the non-uniform temperature distribution that would occur with purely conductive material.
Solution Approach 2:
The thermal conductivity parameter is changed spatially across the fiber submount - high thermal conductivity in the second section for heat release, and low thermal conductivity in the first section for temperature uniformity during soldering. This parameter differentiation resolves the contradiction between heat release efficiency and soldering uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes heat supply and release, enhancing mounting reliability by preventing solder melting and optical fiber degradation, while ensuring uniform solder application and efficient light coupling.
Implementation Method 1
a supporting member for supporting the optical fiber, the supporting member being made from a non heat insulating material and having a solder fixation section to which the optical fiber is fixed by use of solder, the supporting member including a contact portion which is thermally in contact with a heat releasing member
Data Source
AI summary
A laser device includes: a semiconductor laser element having an output surface; an optical fiber having a leading end portion facing the output surface of the semiconductor laser element; and an optical fiber supporting member for supporting the optical fiber, the optical fiber supporting member being made from a non heat insulating material and having a bonding pad to which the optical fiber is fixed by use of solder. The optical fiber supporting member includes a contact portion thermally in contact with a base. The bonding pad is (i) spaced apart from the contact portion so as to be located on a side opposite from the contact portion so that a region to which laser light is applied from another laser element when the optical fiber is fixed to the bonding pad is sandwiched between the bonding pad and the base and (ii) separated spatially from the base.