Semiconductor Package Waveguide Alignment via Adhesive Layer
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high integration density and compactness in System-on-Integrated-Circuit (SoIC) components, particularly in photonics applications, where precise alignment and assembly of optical components are required, leading to increased complexity and cost in optical fiber assembly.
Innovation Solution
A semiconductor package design that includes a substrate with a first waveguide and a semiconductor die featuring a second waveguide aligned with the first, using an adhesive layer for optical coupling, which allows for improved tolerance and alignment accuracy, reducing assembly time and optical loss through refractive index design and total internal reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precise alignment and assembly of optical components are required, then optical coupling efficiency is improved, but assembly complexity and cost increase
Solution Approach 1:
The patent applies preliminary action by pre-aligning the waveguide on the semiconductor die with the waveguide on the substrate before final assembly. The waveguides are positioned and aligned in advance, and the adhesive layer is applied to secure this pre-established alignment, thereby achieving efficient optical coupling while simplifying the overall assembly process.
Solution Approach 2:
The adhesive layer serves as an intermediary element between the semiconductor die and the substrate. It not only bonds the two components together but also maintains the precise alignment of the waveguides, enabling efficient optical coupling without requiring complex alignment mechanisms during assembly.
2Ease of operation
If traditional optical fiber assembly methods are used, then optical fiber connectivity is achieved, but assembly time and optical loss increase
Solution Approach 1:
The patent extracts the optical coupling function from traditional optical fiber assembly methods by integrating waveguides directly into the semiconductor die and substrate. This eliminates the need for separate optical fiber alignment and connection steps, significantly reducing assembly time while maintaining optical connectivity.
Solution Approach 2:
The patent merges the optical fiber function with the semiconductor package structure by integrating waveguides into the die and substrate. This combination eliminates the need for separate optical fiber assembly steps, reducing both assembly time and optical loss while achieving the same connectivity function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances alignment accuracy and reduces assembly time in optical fiber assembly, while minimizing optical loss by ensuring precise alignment and efficient optical coupling between waveguides, thus achieving cost-competitive and scalable photonics semiconductor packages.
Implementation Method 1
total internal reflection
Implementation Method 2
refractive index design
Data Source
AI summary
Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.