Stiffener Device Routing Optical Connections in Co-Packaged Optics
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Solution Overview
Problem
The fabrication of co-packaged optical (CPO) devices is challenging due to the integration of diverse components and processes, particularly with high-temperature manufacturing processes that are not compatible with epoxy-based assembly, and the complication of attaching external connections to CPO devices with stiffener hardware.
Innovation Solution
A stiffener device comprising a stiffener ring that circumscribes optical ICs, with features for receiving light-carrying media and extending to lateral edges, allowing for optical coupling and supporting external connections, and an outer stiffener ring with increased thickness for mechanical support and alignment features for optical connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a stiffener ring is added to provide mechanical support, then coplanarity and warpage performance improve, but external connections become sealed off and harder to route
Solution Approach 1:
The stiffener ring is segmented by introducing discontinuities or openings at specific locations. This segmentation allows external connections such as optical fibers to pass through the stiffener ring while maintaining its mechanical support function, thereby resolving the conflict between improving coplanarity and enabling external connections.
Solution Approach 2:
Alignment features are introduced as intermediary elements that facilitate the routing of external connections through the stiffener ring. These alignment features guide and position the connections properly, enabling easy routing while preserving the stiffener ring's structural integrity and coplanarity improvement.
2Ease of manufacture
If optical components are attached using epoxy, then assembly is simplified, but high-temperature manufacturing processes become incompatible
Solution Approach 1:
Optical components are attached to the substrate before the stiffener ring is installed. This preliminary attachment allows the use of epoxy for bonding, and subsequent steps are designed to protect these epoxy-bonded components from high-temperature exposure, thereby maintaining assembly simplicity while avoiding temperature incompatibility.
Solution Approach 2:
Protective measures are implemented beforehand to shield epoxy-bonded optical components from high-temperature manufacturing processes. This may involve using temperature-resistant materials for the stiffener ring or designing the assembly sequence to minimize thermal exposure to epoxy-bonded components, thus preserving the ease of manufacture while accommodating temperature constraints.
3Adaptability or versatility
If BGA direct-attachment techniques are used, then integration is achieved, but package size increases and high-temperature exposure problems occur
Solution Approach 1:
The stiffener ring is designed with a three-dimensional structure that provides mechanical support and integration capabilities without significantly increasing the planar footprint of the package. By utilizing vertical space and optimizing the ring's cross-sectional geometry, the solution achieves BGA-level integration while minimizing the increase in package area.
Data Source
AI summary
Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.