Silicon Nitride Waveguides for Co-Packaged Interconnects

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current electronic systems face challenges in achieving high-speed data transmission due to length-dependent signal loss in copper interconnects, and existing optical interconnects have limitations in power consumption and propagation loss.

Innovation Solution

The integration of silicon photonics with electronic integrated circuits using a silicon photonic hybrid glass interposer-based planar lightwave circuit for co-packaging, which includes a dielectric substrate with silicon nitride optical waveguides to reduce optical propagation loss and enable longer routing distances with lower power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If copper interconnects are used for signal transmission, then electrical connectivity is achieved, but signal loss increases with length

Engineering Contradiction:

Improvesignal lossVSAvoidinterconnect length

Core Design Contradiction:

Loss of energyVSLength of stationary object

Solution Approach 1:

The patent replaces electrical copper interconnects with optical waveguides for signal transmission. Optical signals experience significantly lower attenuation over long distances compared to electrical signals in copper, directly resolving the contradiction between transmission distance and signal loss. The optical interconnect engine converts electrical signals to optical signals for transmission through the waveguides.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the transmission medium from electrical conductors to optical waveguides, fundamentally altering the transmission parameter from electrical signal to optical signal. This parameter change enables long-distance transmission with low loss, as optical fibers and waveguides have much lower attenuation coefficients compared to copper interconnects.

Inventive Principle:

Principle #35Parameter changes

2Length of stationary object

If optical communications technologies are used, then longer distance transmission is achieved, but different materials and fabrication processes are required

Engineering Contradiction:

Improvetransmission distanceVSAvoidfabrication process compatibility

Core Design Contradiction:

Length of stationary objectVSEase of manufacture

Solution Approach 1:

The patent merges optical communication technology with silicon electronics by integrating optical waveguides fabricated on silicon substrates with electronic integrated circuits. This convergence allows both optical and electronic components to be manufactured using compatible silicon-based fabrication processes, resolving the contradiction between transmission distance and manufacturing ease.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes silicon photonics technology to change the material platform to silicon, which is compatible with existing CMOS fabrication processes. This enables optical waveguides to be manufactured using standard semiconductor manufacturing techniques, making long-distance optical transmission economically viable and manufacturable.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If multi-chip modules are used, then signal integrity is improved, but copper interconnects are still required for external communication

Engineering Contradiction:

Improvesignal integrityVSAvoidinterconnect loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent replaces the external copper interconnect path with an optical transmission path. By integrating an optical interconnect engine and waveguides within the multi-chip module, signals can be transmitted optically to external devices, eliminating the need for lossy copper interconnects for external communication while maintaining the signal integrity benefits of multi-chip module architecture.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides low interconnect loss and reduced power consumption, enabling ultra-high speed interconnects exceeding 50 or 100 Gbps for applications like supercomputers and data centers, with flexible optical routing and improved signal integrity.

Implementation Method 1

a silicon photonic hybrid glass interposer-based planar lightwave circuit for co-packaging, which includes a dielectric substrate with silicon nitride optical waveguides to reduce optical propagation loss

Methodology Applied

Scientific EffectOptical waveguide: Waveguide (optics)

Data Source

PatentUS20240264396A1Co-packaging with silicon photonics hybrid planar lightwave circuit

Publication Date: 2024.08.08 INTEL CORP

AI summary

An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.