Adjusting Connector Sizes for Uniform Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing interconnect structures in integrated circuits face limitations in performance and density due to non-uniform connector densities and heights across the chip surface, leading to inconsistent electrical connections and potential defective joints.
Innovation Solution
A method is developed to adjust the lateral dimensions of connectors on a package component by modifying their sizes in sparse and dense regions to achieve uniform connector densities, using equations to calculate and adjust the dimensions while ensuring compliance with design rules, resulting in improved co-planarity and reduced defective joints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform connector sizes are used across the chip surface, then manufacturing process is simple, but connector density becomes non-uniform leading to defective joints
Solution Approach 1:
The patent applies local quality by varying connector sizes according to their spatial location on the chip surface. Connectors in different regions (sparse vs. dense areas) are assigned different sizes to achieve uniform density distribution. This resolves the contradiction by sacrificing global uniformity for local optimization, ensuring reliable joints throughout the entire chip surface.
2Reliability
If connector sizes are adjusted to achieve uniform density, then joint reliability improves, but manufacturing process complexity increases
Solution Approach 1:
The patent changes the size parameter of connectors based on their location to achieve uniform density. By systematically varying this single geometric parameter across different chip regions, the patent improves joint reliability while keeping the manufacturing process relatively simple, avoiding the need for complex multi-parameter adjustments.
3Manufacturing precision
If connector sizes are varied by region, then connector density uniformity improves, but design rule compliance becomes more difficult
Solution Approach 1:
The patent segments the chip surface into different regions (sparse and dense areas) and applies different connector size rules to each segment. This segmentation approach makes it easier to manage design rule compliance by treating different regions independently, while still achieving overall density uniformity across the entire chip surface.
Data Source
AI summary
A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.