Contact Electroplating Isolated Structures via Mesh Electrodes
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Solution Overview
Problem
Current electroplating methods for flexible electronics and IC processing face challenges such as inferior conductivity, complex processes, and difficulty in achieving uniform electrical contact to isolated or nano-scale structures, leading to inefficient metal deposition and structural limitations in high-density flexible electronics and IC fabrication.
Innovation Solution
An electroplating apparatus comprising a working electrode and counter electrode made from fine metal mesh or metal fiber cloth, with a chemically inert porous material in between, allowing direct contact and simultaneous electrical connection to substrates, enabling uniform metal deposition across large areas and eliminating the need for peripheral contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electroplating methods are used for isolated structures, then peripheral contact is required, but uniform electrical contact to all structures cannot be achieved
Solution Approach 1:
The patent divides the substrate into multiple isolated structures (trenches, posts, or holes) that are independently plated. Each structure receives electrical contact through the electrolyte solution rather than through a continuous peripheral contact system, enabling uniform plating across all structures regardless of their position or size.
Solution Approach 2:
The patent introduces an electrolyte solution as an intermediary medium that provides electrical contact to all isolated structures. The electrolyte acts as a conductor that bridges the power supply to each individual structure, eliminating the need for direct physical contact with each structure while ensuring uniform electrical connection.
2Reliability
If seed layers are used to enable electroplating, then electrical contact is improved, but the seed layer thickness must be increased for large area substrates
Solution Approach 1:
The patent uses the electrolyte solution (hydraulic medium) to deliver electrical current to the substrate structures. The electrolyte flows through the plating solution and provides the necessary electrical contact through ionic conduction, eliminating the need for thick seed layers that would be required to conduct the same current through electronic conduction alone.
3Reliability
If metal pastes are used for flexible electronics, then conductivity is improved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent replaces the mechanical printing process (screen printing or inkjet printing of metal pastes) with an electrochemical process (electroplating). Instead of mechanically depositing paste materials that require drying and sintering, the system uses electrical current to directly deposit pure metal onto the substrate, eliminating multiple process steps and significantly reducing production time.
Solution Approach 2:
The patent changes the fundamental parameter of metal deposition from physical/chemical paste application to electrochemical metal ion reduction. By changing from paste deposition (requiring solvents, drying, and sintering) to direct electroplating (using metal salts and electrical current), the process achieves superior conductivity with fewer steps and faster cycle times.
4Ease of operation
If electroless plating is used, then direct control is reduced, but the process is spontaneous and hard to control
Solution Approach 1:
The patent uses periodic or pulsed electrical current to control the electroplating process. By applying current in controlled pulses rather than continuous flow, the system maintains precise control over metal deposition while preventing unwanted side reactions and ensuring uniform deposit quality across all substrate structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient and uniform electroplating of pure metals onto substrates with high resistance seed layers, enhancing conductivity and simplifying the process of trench filling in IC devices, while enabling surface finishing of isolated electronic devices with desired metals like nickel, gold, and silver.
Implementation Method 1
apparatus and method of electroplating metals by direct contact onto isolated or weekly connected structures
Implementation Method 2
electroplating of pure metals onto substrates with high resistance seed layers
Data Source
AI summary
The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.