Contacting Devices TRIZ Cases

Conductive members bridge adhesive-mounted brackets to maintain plating current, preventing uneven chrome, corrosion, and grille surround failure.

Dynamic electrical contact enables full interior and exterior nanolaminate coating of tubular workpieces without blocked electrolyte flow.

A rotating contact assembly and interior anode enable full nanolaminate coverage on tubular surfaces without blocked electrolyte flow.

Notched electrical contacts and expanded-head engaging shafts speed replacement while keeping stable substrate-edge conduction for plating.

Segmented insulated anode paths suppress additive decomposition, voltage rise, and heating in alkaline zinc-nickel electroplating baths.

Vacuum suction replaces manual fastening in a plating frame, improving contact uniformity, automation, and reducing over-plating.

A stopper-limited centering pin prevents overtravel from holder clearance, keeping substrate alignment and power contact stable during plating.

A galvanic plating module uses substrate guiding elements on a covering plate to hold thin flexible substrates during transport.

Parallel plates supply an air cushion to flatten and hold flexible workpieces without direct contact.

Dual-part substrate holder enables uniform vertical galvanic metal deposition through integrated contact elements and hanging mechanisms.

Positioning force application closer to clampers reduces operational effort while maintaining reliable substrate sealing.

Optimized contact geometry reduces summed surface area below 127.01 mm2 to lower manufacturing costs while maintaining adhesion and conductivity.

An internal pin and ring fix holding members inside a sealed space, preventing plating solution contact with the clamp mechanism.

An inner anode protrudes into treated cavities to maintain high current density, resolving non-uniform coating thickness issues.

Segmented seal members and biasing mechanisms maintain uniform sealing pressure on large substrates despite warpage or thinning variations.

Composite seal structure eliminates adhesives to prevent electrolyte contamination while reducing production costs for electroplating systems.

Segmented carrier bodies prevent solution trapping to ensure complete plating while removable clips reduce maintenance downtime.

Segmented contact fingers with varying lengths prevent thin semiconductor substrates from cracking by providing stable electrical connection and necessary lift.

Segmented chuck assembly allows contact ring maintenance outside the processor, eliminating idle downtime during cleaning procedures.

Segmented rotating contact wheels switch polarity to remove metallized layers, eliminating auxiliary cathodes and reducing maintenance costs.

A horizontal electrochemical deposition method uses flowing electrolyte to deposit metal uniformly on solar cell substrates.

A substrate holder integrates central and radial power supply members to contact diverse substrates.

Contoured cup bottoms with protrusions and insulated portions compensate for reduced conductivity in notch areas to ensure uniform electroplating thickness.

A convex chuck maintains consistent contact with substrates during electrochemical replication processes.

A substrate holder interposes holding members to correct deformation and secure the workpiece.

Rotatable gears rotate turbine blades during electroplating, ensuring uniform coating thickness without manual monitoring or adjustments.

A pliable contact body maintains direct contact with printed wiring boards during electroplating to ensure uniform metal deposition.

Integrating elastomeric lipseals with contact elements eliminates alignment precision issues while excluding plating solution from substrate edges.

A transporter frame uses flipside and transitional support elements to immobilize silicon electrodes along gravitational and opposing force vectors.

A molded article uses an insulating barrier between plateable regions to prevent plating material migration during electroplating.

Embedded sensors transmit collector temperature wirelessly, preventing overheating damage and maintaining electrical contact quality.

An elastic unit in the electrode case accommodates irregular frame movement to maintain stable electroplating current delivery.

Frame legs support fragile substrates to reduce mechanical stress while enabling simultaneous batch processing through integrated electrical contacts.

A device supports flat substrates horizontally at the electrolytic fluid surface using dielectric carrier bodies and spring-loaded guide members.

A mesh electrode apparatus deposits pure metals onto isolated substrates through direct electrical contact.

Continuous rotation eliminates uncoated contact areas and layer defects, delivering uniform galvanic coating on bearing rings within the electrolyte bath.

A substrate holder uses a rotatable clamp to sandwich and fix wafers securely between holding members.

Laser irradiation creates a diffusion layer between underlayer and seed layer, preventing peeling during metal deposition.

An auxiliary electrode maintains a non-conductive state during electroless plating to ensure uniform metallic coating thickness.

Selective contact layers prevent seed layer damage during electrochemical processing, ensuring reliable interconnect formation.

A substrate holder uses a removal portion to scrape insulating materials from the substrate surface before electrical contact.