Rotatable Clamp Substrate Holder for Uniform Plating

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Solution Overview

Problem

Existing substrate holders face challenges in uniformly holding substrates of varying sizes, shapes, and thicknesses, leading to potential deflection, damage, or non-uniform plating due to inadequate contact and power supply configurations, particularly when dealing with large substrates of small thickness and quadrangular shapes.

Innovation Solution

A substrate holder design featuring a first and second holding member that sandwich the substrate, with a rotatable or reciprocable clamp mechanism to securely fix the substrate, and a configuration allowing for efficient electrical connection through exposed cable ends and conductive members, ensuring stable holding and uniform power distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a press ring is rotated to engage with dampers to fix the substrate, then the substrate can be secured to the holder, but large substrates with small thickness may deflect due to the rotation force

Engineering Contradiction:
Improvesubstrate fixation reliabilityVSAvoidsubstrate flatness
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

Instead of rotating the press ring to engage with dampers (conventional method), the invention inverts the approach by using a clamp that rotates about a shaft parallel to the holding member surface, engaging directly with the substrate edge. This inversion eliminates the damper engagement mechanism that causes deflection while maintaining secure fixation through direct clamping action.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The holding mechanism is segmented into separate functional components: a clamp body, a rotating shaft, and engagement elements. This segmentation allows the clamp to rotate independently about a parallel shaft, distributing the fixation force more evenly and avoiding the concentrated rotational stress that causes substrate deflection in conventional single-piece press ring designs.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If multiple external connection contacts are formed using an integral member, then power supply uniformity may improve, but electrical resistances cannot be measured before plating

Engineering Contradiction:
Improveplating film thickness uniformityVSAvoidpower supply reliability verification
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The invention implements preliminary conduction confirmation processing before plating treatment. The system measures electrical resistance between external connection contacts in advance, allowing verification of power supply reliability before the actual plating process begins. This preliminary action ensures that uniformity issues can be detected and corrected beforehand.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system incorporates feedback mechanisms through conduction confirmation processing that measures electrical resistance values and provides information about power supply uniformity. This feedback allows operators to verify contact performance and make adjustments before plating, ensuring reliable and uniform power distribution throughout the process.

Inventive Principle:
Principle #23Feedback

3Reliability

If grip members fix the board by screwing blocks together, then the board can be securely held, but the configuration is not suitable for automation

Engineering Contradiction:
Improveboard holding securityVSAvoidholding process automation
Core Design Contradiction:
ReliabilityVSExtent of automation

Solution Approach 1:

The invention replaces the manual screwing mechanism with an automated rotating clamp system. The clamp rotates about a shaft and engages with the substrate through controlled rotational motion, which can be easily automated using motors or actuators. This substitution maintains secure holding through mechanical clamping force while enabling full automation of the holding process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11384447B2Substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrate
Publication Date: 2022.07.12 EBARA CORP
  • US11384447B2 patent drawing
  • US11384447B2 patent drawing
  • US11384447B2 patent drawing

AI summary

Provided is a substrate holder including a first holding member and a second holding member configured to sandwich and fix a substrate, wherein the first holding member includes a first holding member body, and a clamp provided on the first holding member body, the clamp being rotatable about a shaft extending parallel to a surface of the first holding member body, or being reciprocable in a direction intersecting with the surface of the first holding member body, the second holding member includes a second holding member body, and the clamp is capable of engaging with the second holding member in a state where the first holding member body and the second holding member body are brought into contact with each other, to fix the second holding member to the first holding member.