Single-Sided Electrolytic Treatment Device for Flat Substrates
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Solution Overview
Problem
Existing devices for single-sided electrolytic treatment of flat substrates, such as solar cells with CIGS semiconductor material, face limitations in current densities and uniformity due to unstable fluid pressure and are not suitable for treating plate-like substrates or substrates with sputtered base layers, leading to inefficient production and high costs.
Innovation Solution
A device with a bath for electrolytic fluid and conveying means that supports flat substrates horizontally, using dielectric carrier bodies with support edges and spring-loaded guide members for stable cathodic connection, allowing high current densities and uniform treatment of both strip and plate-like substrates, including those with dielectric materials coated with conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If compressed air acts on strip material from above via an apertured plate to achieve flat position, then contact with electrolytic fluid is optimized, but current density is limited and deposition rate is limited
Solution Approach 1:
Instead of pressing the substrate from above using compressed air, the patent inverts the approach by supporting the substrate from below using the electrolytic fluid pressure itself and air pressure from beneath, allowing the substrate to float in a stable equilibrium position that enables both good contact and high current density
Solution Approach 2:
The patent employs pneumatic pressure from below (through the electrolytic fluid and apertured plate) to support and position the substrate, replacing the conventional approach of pneumatic pressing from above, thereby achieving both stable contact and high deposition rates
2Ease of operation
If strip material floats on electrolytic fluid with compressed air from above, then contact is achieved, but distance from foil to anode fluctuates strongly due to unstable equilibrium, causing non-uniform layer thickness
Solution Approach 1:
The patent inverts the pressure application direction, supporting the substrate from below rather than pressing from above, creating a stable equilibrium where the substrate naturally positions itself at a consistent distance from the anode, eliminating fluctuations and ensuring uniform layer thickness
Solution Approach 2:
The patent uses the electrolytic fluid and air pressure from below as a cushioning mechanism that pre-establishes a stable equilibrium position for the substrate, preventing distance fluctuations before they can occur and ensuring consistent anode-to-foil spacing throughout the treatment process
3Ease of manufacture
If known device uses floating strip with compressed air from above, then treatment is achieved, but device is not suitable for plate-like substrates or substrates with sputtered base layers
Solution Approach 1:
The patent creates a universal treatment system that can handle multiple substrate types (strip material from reels, discrete plates, foils with sputtered layers) by using a support mechanism from below that adapts to different substrate geometries and material properties, making the device multi-functional and highly adaptable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high current densities and uniform layer deposition, supporting the use of substrates with dielectric materials and reducing the need for frequent cleaning by preventing electrolytic fluid contact with spring means, thus enhancing the efficiency and cost-effectiveness of the electrolytic treatment process.
Implementation Method 1
at least one spring means having an upper side which, in unloaded condition, is located above the level of the upper side of the support edge, at least at the location of the bath, the upper side of which spring means is elastically compressible in downward direction under the influence of a downward force exerted on the spring means by the substrate
Implementation Method 2
bath for electrolytic fluid, conveying means for conveying the flat substrate in a conveying direction at the free surface of the electrolytic fluid in the bath
Implementation Method 3
at least one guide member of an electrically conductive material, which is connected to said at least one carrier body, for cathodically connecting the underside of the substrate
Data Source
AI summary
The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.