Wiring Board Adhesion via Laser Diffusion Layer
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Solution Overview
Problem
Conventional methods for manufacturing wiring boards face challenges in achieving strong adhesion between the underlayer and seed layer, leading to peeling issues during metal deposition, especially when forming minute wiring patterns and in environments where the underlayer and seed layer are not securely bonded.
Innovation Solution
A method that forms a diffusion layer between the underlayer and seed layer by irradiating the seed layer with a laser beam, improving adhesion without the need for a resin resist pattern, and using a solid electrolyte membrane to deposit metal ions onto the seed layer, ensuring selective metal layer formation on the seed layer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a power source is coupled to the seed layer to form wiring patterns, then metal deposition can be achieved, but it becomes difficult to couple the power source to all wiring portions when the wiring pattern becomes minute
Solution Approach 1:
The patent introduces an underlayer as an intermediary between the power source and the minute seed layer wiring patterns. The underlayer has larger wiring patterns that are easier to couple with the power source, while still enabling metal deposition onto the finer seed layer patterns through electrical connection.
Solution Approach 2:
The patent divides the wiring structure into two functional layers: an underlayer with larger, easier-to-connect patterns for power source coupling, and a seed layer with minute wiring patterns for the actual fine wiring. This segmentation allows each layer to optimize for its specific function.
2Ease of manufacture
If the adhesion between underlayer and seed layer is low, then manufacturing is simpler, but the underlayer and seed layer peel off during metal deposition or in use
Solution Approach 1:
The patent performs preliminary adhesion enhancement by forming a diffusion layer between the underlayer and seed layer before metal deposition. This preliminary action prevents peeling during subsequent metal deposition or use, ensuring reliability from the outset.
Solution Approach 2:
The patent creates a composite structure at the interface between underlayer and seed layer by forming a diffusion layer. This composite material approach combines the underlayer and seed layer materials through atomic diffusion, creating a strong bonded interface that prevents peeling.
3Manufacturing precision
If a resin resist pattern is used to form the metal layer, then selective deposition is achieved, but multiple manufacturing steps and liquid waste generation increase
Solution Approach 1:
The patent extracts and eliminates the resin resist pattern from the manufacturing process. Instead of using resist for selective deposition, the invention uses the inherent properties of the underlayer and diffusion layer to enable selective metal formation directly on the seed layer without additional resist materials or removal steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of the wiring board by improving the adhesion between the underlayer and seed layer, preventing peeling and reducing the complexity and waste associated with resist pattern formation, while allowing for high-density wiring patterns.
Implementation Method 1
the seed layer is irradiated with a laser beam to form, between the underlayer and the seed layer, a diffusion layer in which an element forming the underlayer and an element forming the seed layer are mutually diffused
Implementation Method 2
pressing a solid electrolyte membrane against the seed layer and applying voltage between an anode and the underlayer to reduce metal ions contained in the solid electrolyte membrane
Data Source
Figure 1
Figure 2A~2D
Figure 3~4
AI summary
A method for manufacturing a wiring board capable of improving adhesion between an underlayer and a seed layer. An electrically conductive underlayer is disposed on the surface of an insulating substrate and a seed layer containing metal is disposed on the surface of the underlayer to prepare a substrate with seed-layer. A diffusion layer in which elements forming the underlayer and seed layer are mutually diffused is formed between the underlayer and the seed layer, by irradiating the seed layer with a laser beam. A metal layer is formed on the surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from the insulating substrate.