Galvanic Plating Module Substrate Guiding Elements
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Solution Overview
Problem
The challenge lies in safely transporting and processing thin, flexible substrates through horizontal galvanic plating lines without damaging them, as they tend to crumple or move undesirably between transport elements, leading to poor metal deposition results.
Innovation Solution
A galvanic plating device with a galvanic plating module arranged below the transport level, featuring a plating clamp and substrate guiding elements on a covering plate with openings, which supports the substrate without traditional transport elements like rollers, ensuring safe passage and maintaining the substrate's position during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional transport elements like rollers and wheel axes are used below the transport level, then the substrate can be supported during transport, but thin flexible substrates crumple or run between the transport elements causing damage
Solution Approach 1:
The invention removes traditional transport elements like rollers and wheel axes from below the transport level, extracting the harmful components that cause substrate crumpling. Instead, the substrate is supported only from above by the transport belt and guiding elements, eliminating the risk of substrates running between transport elements.
Solution Approach 2:
The invention introduces intermediate guiding elements (side guides and rear guides) that act as mediators to control substrate position without requiring traditional support from below. These guiding elements work together with the transport belt to maintain substrate stability during transport through the galvanic plating chamber.
2Reliability
If substrates are fixed at both sides by clips, hooks or clamps, then transport stability is improved, but substrates bend after a certain period causing undesired metal deposition results
Solution Approach 1:
The invention removes side fixation elements like clips, hooks, or clamps from the transport system. Instead of fixing substrates at both sides, the substrate is held only by the transport belt from above, eliminating the bending problem that occurs with prolonged clamping while maintaining adequate transport stability.
Solution Approach 2:
The transport system transitions from a static clamping approach to a dynamic belt-based support system. The flexible transport belt adapts to substrate thickness variations and movements without causing bending, providing continuous support that maintains substrate flatness throughout the transport process.
3Object-affected harmful factors
If substrates are not supported from below, then substrate crumpling is prevented, but substrates may move undesirably during transport
Solution Approach 1:
The invention introduces intermediate guiding elements (side guides and rear guides) as mediators to control substrate position without requiring support from below. These guides work together with the transport belt to prevent undesired substrate movement while maintaining the benefit of no crumpling from traditional roller support.
Solution Approach 2:
The transport system applies support and guidance locally at specific positions (side guides at edges, rear guide at the back) rather than continuous support from below. This localized guidance approach prevents substrate movement where needed while avoiding the crumpling caused by traditional roller support across the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents damage to thin substrates, maintains their position, and ensures uniform metal deposition, even without traditional transport elements, while being easily integratable into existing process lines with minimal effort and cost.
Implementation Method 1
galvanic plating device of a horizontal galvanic plating processing line for galvanic metal, in particular copper, deposition
Implementation Method 2
at least a plating clamp arranged on a first side of the galvanic plating device
Data Source
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AI summary
The present invention is related to a galvanic plating device of a horizontal galvanic plating processing line for galvanic metal, in particular copper, deposition; wherein said galvanic plating device comprises at least a first galvanic plating module, which is arranged below a transport level of a substrate to be treated, and at least a plating clamp arranged on a first side of the galvanic plating device; wherein said first galvanic plating module comprises at least an electrolyte nozzle and at least an anode element inside of said galvanic plating module, wherein said galvanic plating module further comprises at least a covering plate having a plurality of openings arranged above the anode element and the electrolyte nozzle, wherein the galvanic plating device further comprises at least a substrate guiding element arranged on the surface of the covering plate of the galvanic plating module, wherein said substrate guiding element is in conjunction with said surface of the covering plate of the galvanic plating module. The present invention is further related to the use of such a galvanic plating device for galvanic metal, preferably copper, deposition on printed circuit foils, flexible printed circuit boards and embedded chip substrates.