Integrated Elastomeric Lipseal and Contact Element for Electroplating
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Solution Overview
Problem
In electroplating processes for integrated circuits, the challenge lies in establishing optimal electrical connections and preventing leakage, particularly due to the corrosive nature of electroplating solutions and the thinning of conductive seed layers at the substrate edges, which complicates the alignment and integration of lipseals and contact elements in clamshell assemblies.
Innovation Solution
The integration of elastomeric lipseals with structurally integrated contact elements that form conformal contact surfaces and sealing protrusions, allowing for precise alignment and sealing of semiconductor substrates while excluding plating solution from peripheral regions and providing reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate lipseal and contact element components are used in clamshell assemblies, then flexibility in component selection and replacement is improved, but alignment precision and integration reliability deteriorate due to the corrosive nature of electroplating solutions and thinning conductive seed layers at substrate edges
Solution Approach 1:
The patent combines the lipseal and contact element into a single integrated component structure. The contact element is positioned within the lipseal such that both functions (sealing and electrical contact) are performed by one integrated assembly, eliminating alignment issues between separate components while maintaining the ability to select different material compositions for each functional region.
Solution Approach 2:
The integrated lipseal-contact element structure uses composite material construction with different material properties in different regions. The lipseal portion uses elastomeric or flexible materials for sealing, while the contact element portion uses conductive materials optimized for electrical contact with the substrate edge, allowing each region to be optimized for its specific function within the same component.
2Reliability
If contact elements are positioned closer to substrate edges to compensate for thinning seed layers, then electrical connection reliability is improved, but leakage risk increases due to proximity to the sealing interface
Solution Approach 1:
The contact element is positioned locally within the lipseal structure at an optimized distance from the substrate edge. The lipseal provides a sealing interface that is radially outward from the contact element, creating distinct functional zones: the contact element region for reliable electrical contact with the thinned edge seed layer, and the lipseal region for leakage prevention. This local differentiation allows both functions to operate optimally without interfering with each other.
3Ease of manufacture
If traditional separate component assemblies are used, then ease of manufacture is improved, but device complexity increases due to multiple alignment and integration steps
Solution Approach 1:
By integrating the contact element within the lipseal as a unified structure, the patent reduces the number of discrete components that need to be assembled. The integrated design allows the contact element to be positioned and secured within the lipseal in a single manufacturing step, eliminating multiple alignment and fastening operations required for separate components, thus reducing overall assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of electrical connections, reduces leakage, and simplifies the alignment process by integrating contact elements within the elastomeric lipseals, ensuring efficient electroplating operations with improved substrate alignment and sealing efficacy.
Implementation Method 1
an elastomeric lipseal for engaging the semiconductor substrate
Implementation Method 2
one or more contact elements for supplying electrical current to the semiconductor substrate during electroplating
Implementation Method 3
electroplating is a common technique used in integrated circuit (IC) fabrication to deposit one or more layers of conductive metal
Implementation Method 4
deposit metal onto the substrate surface from metal ions available in the electrolyte
Data Source
AI summary
Disclosed herein are lipseal assemblies for use in an electroplating clamshell for engaging and supplying electrical current to a semiconductor substrate during electroplating, which include an elastomeric lipseal for engaging the semiconductor substrate during electroplating, and wherein upon engagement the elastomeric lipseal forms multiple radially-separated sealing contact surfaces with the substrate which substantially exclude plating solution from a peripheral region of the substrate. Said lipseal assemblies may also include one or more electrical contact elements for supplying electrical current to the semiconductor substrate during electroplating.