Vacuum Plating Frame Assembly for Uniform Substrate Contact
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Solution Overview
Problem
Existing plating frames for substrates in electroplating processes suffer from non-uniform electrical contacts, manual fastening issues leading to non-homogeneous forces, and complex geometry clamping systems that result in unreliable electroplating, shielded surface areas, and over-plating in contact areas, hindering automation and increasing costs.
Innovation Solution
A plating frame unit using vacuum suction to attach frame portions, with finger-shaped electric contacts and optional sealing, allowing uniform electroplating, automated handling, and reduced over-plating, while using softer materials for higher conductivity and speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual screw fastening is used to secure the substrate, then the substrate can be fixed in place, but non-homogeneous forces are exerted onto the substrate resulting in unreliable electrical contacts
Solution Approach 1:
The patent replaces the manual screw fastening system with a vacuum-based holding system. The vacuum unit creates uniform suction forces across the substrate surface, eliminating the need for manual screw operations. This substitution of mechanical fastening with vacuum adhesion resolves the contradiction by providing both reliable substrate fixation and homogeneous force distribution, while enabling automated operation.
Solution Approach 2:
The patent employs a vacuum unit (pneumatic system) to hold the substrate in place during electroplating. The vacuum creates uniform negative pressure across the substrate surface, ensuring homogeneous force distribution and reliable electrical contacts without requiring manual screw fastening. This pneumatic approach eliminates operational complexity while maintaining substrate security.
2Reliability
If complex geometry clamping systems are used to secure the substrate, then the substrate can be held firmly, but corners, edges and gaps are created which are challenging and time consuming to rinse and dry
Solution Approach 1:
The patent replaces complex mechanical clamping systems with a vacuum holding system. The vacuum unit secures the substrate through uniform suction across the surface without creating corners, edges, or gaps associated with traditional clamps. This eliminates the time-consuming rinsing and drying operations while maintaining firm substrate fixation throughout the electroplating process.
3Reliability
If dry-contact frames with sealing rings are used to protect electrical contacts, then the electrical contacts are protected from electrolyte, but large parts of the substrate surface are shielded reducing the available surface area for building devices
Solution Approach 1:
The patent extracts the sealing ring from the system entirely, transitioning from a dry-contact frame to a wet-contact frame. The electrical contacts are designed to be naturally resistant to electrolyte without requiring protective sealing rings. This extraction eliminates the substrate surface area that was previously shielded by sealing rings, maximizing the available area for device fabrication while maintaining electrical contact protection through material selection and contact design.
4Reliability
If wet-contact frames are used without sealing, then the electrical contacts provide reliable electrical contact, but the contacts become heavily coated during electroplating resulting in plating variability
Solution Approach 1:
The patent changes the material parameters of the electrical contacts by using inert materials such as platinum, gold, or other electrolyte-resistant conductive materials. This parameter change allows the contacts to withstand direct exposure to electrolyte without becoming heavily coated, maintaining both reliable electrical contact and consistent electroplating uniformity throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables uniform electroplating with reliable electrical contacts, automated loading, reduced over-plating, and efficient rinsing and drying, lowering costs and resource consumption.
Implementation Method 1
The vacuum unit is configured to reduce an inner pressure between the front frame portion and the back frame portion below a surrounding pressure to attach the front frame portion relative to the back frame portion
Data Source
AI summary
The disclosure relates to a plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate and a method for assembling a plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate. The plating frame unit comprises a front plate, a back plate, and a vacuum unit. The front plate comprises a front frame portion surrounding a front recess portion. The back plate comprises a back frame portion. The front frame portion and the back frame portion are connected to each other to hold the substrate between them. The vacuum unit is configured to reduce an inner pressure between the front frame portion and the back frame portion below a surrounding pressure to attach the front frame portion relative to the back frame portion.