Pliable Contact Body for Uniform Plating on Uneven PCB Surfaces

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Solution Overview

Problem

Conventional plating methods struggle to achieve uniform plated films and efficient filling performance in non-through-holes and through-holes of printed wiring boards, especially when the surfaces are uneven, leading to potential wiring rupture and degraded electrical characteristics.

Innovation Solution

A plating apparatus and method utilizing a pliable contact body that makes direct contact with the printed wiring board, accommodating uneven surfaces and ensuring uniform plating by maintaining a fresh supply of plating solution, thereby enhancing current density and plating growth speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional plating methods are used on uneven surfaces, then plating can be performed, but uniform plated films cannot be achieved

Engineering Contradiction:

Improveuniformity of plated filmVSAvoidadaptability to uneven surfaces

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The contact body is designed to be movable and adaptable, allowing it to dynamically adjust to the uneven surface of the printed wiring board during plating. This enables the contact body to maintain close contact with the surface while accommodating variations in topography, thereby achieving uniform plated films on uneven substrates.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The contact body is constructed as a flexible structure that can conform to the surface geometry of the printed wiring board. This flexibility allows the contact body to adapt to uneven surfaces while maintaining consistent plating contact, resolving the contradiction between achieving uniform plating and adapting to surface variations.

Inventive Principle:

Principle #30Flexible shells and thin films

2Manufacturing precision

If conventional plating methods are used, then plating can be performed, but filling performance in through-holes and non-through-holes is poor

Engineering Contradiction:

Improvefilling performanceVSAvoidplating efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The contact body is designed with differentiated local properties, including varying hardness, elasticity, and surface characteristics in different regions. This allows specific areas of the contact body to optimize interaction with through-holes and non-through-holes, improving filling performance while maintaining overall plating efficiency.

Inventive Principle:

Principle #3Local quality

3Stability of the object's composition

If contact body is made rigid, then structural stability is achieved, but inability to accommodate uneven surfaces results

Engineering Contradiction:

Improvestructural stabilityVSAvoidability to accommodate uneven surfaces

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The contact body is constructed as a composite structure combining materials with different mechanical properties. This composite design provides both structural stability from rigid components and adaptability to uneven surfaces from flexible components, resolving the contradiction between stability and surface accommodation.

Inventive Principle:

Principle #40Composite materials

4Productivity

If plating solution supply is not refreshed, then plating ingredients are conserved, but plating growth speed decreases

Engineering Contradiction:

Improveplating growth speedVSAvoidconsumption of plating ingredients

Core Design Contradiction:

ProductivityVSLoss of substance

Solution Approach 1:

The plating system is designed to automatically refresh the plating solution in contact with the substrate through the movement and pressure application of the contact body. This self-service mechanism ensures continuous supply of fresh plating solution to maintain high plating growth speed without requiring external intervention, while the system optimizes solution usage to minimize waste.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in plated films with uniform thickness and improved filling performance, reducing the risk of wiring rupture and maintaining reliable electrical characteristics even under thermal stress, while minimizing the consumption of plating ingredients.

Implementation Method 1

perform plating in non-through-hole openings or through-hole openings of a printed wiring board having at least either non-through holes or through-holes to form via-hole conductors or through-hole conductors

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS8679576B2Plating apparatus and method of plating

Publication Date: 2014.03.25 IBIDEN CO LTD

AI summary

A plating apparatus and method to perform plating in non-through-hole openings or through-hole openings of a printed wiring board having at least either non-through holes or through-holes to form via-hole conductors or through-hole conductors. The plating method contacts a printed wiring board having the non-through holes or through-holes with a plating solution including plating ingredients, and plates metal on a surface of the printed wiring board while making contact with at least a portion of a pliable contact body.