Sealed Substrate Holder Pin Ring Fixing Mechanism
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Solution Overview
Problem
Conventional substrate holders experience significant plating solution loss and poor cleaning efficiency due to the external clamp mechanism, which allows plating solution to attach and remain on the holder during removal from the plating bath.
Innovation Solution
A substrate holder design featuring a first and second holding member with a sealing mechanism, a pin, and a ring that engages to fix the members internally, forming a sealed space to prevent plating solution contact with the fixing mechanism, utilizing a moving mechanism to circumferentially move the ring and pin for secure engagement within the sealed space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an external clamp mechanism is used to fix the holding members, then the substrate holder can be assembled and disassembled easily, but plating solution attaches to the clamp mechanism causing large solution loss and poor cleaning efficiency
Solution Approach 1:
The clamp mechanism is extracted from the external position and moved inside the sealed space. The ring and pin components are positioned within the sealed chamber formed by the first and second holding members, so that when the holder is removed from the plating bath, the clamp mechanism does not contact the plating solution, thereby reducing solution loss and improving cleaning efficiency.
Solution Approach 2:
The clamp mechanism (ring and pin) is nested within the sealed space formed by the first and second holding members. The ring is disposed on one holding member while the pin is fixed to the other, and both are positioned inside the sealed chamber, creating a nested configuration where the fastening components are contained within the protective sealed environment.
2Ease of operation
If an external clamp mechanism is used to fix the holding members, then the substrate holder can be assembled and disassembled easily, but cleaning efficiency deteriorates due to plating solution attachment
Solution Approach 1:
The clamp mechanism is extracted from the external position and moved inside the sealed space. The ring and pin components are positioned within the sealed chamber formed by the first and second holding members, so that when the holder is removed from the plating bath, the clamp mechanism does not contact the plating solution, thereby reducing solution loss and improving cleaning efficiency.
Solution Approach 2:
The clamp mechanism (ring and pin) is nested within the sealed space formed by the first and second holding members. The ring is disposed on one holding member while the pin is fixed to the other, and both are positioned inside the sealed chamber, creating a nested configuration where the fastening components are contained within the protective sealed environment.
3Ease of manufacture
If the clamp mechanism is exposed outside the substrate holder, then the structure is simple and easy to manufacture, but the amount of plating solution taken out from the plating bath becomes large
Solution Approach 1:
The clamp mechanism is extracted from the external position and moved inside the sealed space. The ring and pin components are positioned within the sealed chamber formed by the first and second holding members, so that when the holder is removed from the plating bath, the clamp mechanism does not contact the plating solution, thereby reducing solution loss and improving cleaning efficiency.
Solution Approach 2:
The clamp mechanism (ring and pin) is nested within the sealed space formed by the first and second holding members. The ring is disposed on one holding member while the pin is fixed to the other, and both are positioned inside the sealed chamber, creating a nested configuration where the fastening components are contained within the protective sealed environment.
Data Source
AI summary
There is provided the substrate holder for holding a substrate comprising a first holding member, a second holding member, a sealing member, a pin, a ring, and a moving mechanism. The sealing member forms a sealed space inside the substrate holder. The pin is fixed to one of the first holding member and the second holding member. The ring is disposed on another of the first holding member and the second holding member. The ring engages with the pin. The moving mechanism circumferentially moves the ring. The pin and the ring are engaged with one another to fix the first holding member and the second holding member to one another. The pin and the ring are disposed inside the sealed space.


