Substrate Holder Segmented Sealing for Warpage
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Solution Overview
Problem
Existing substrate holders face challenges in achieving uniform sealing pressure over large-sized substrates, which can warp or thin, leading to difficulties in manufacturing components with sufficient surface and dimensional accuracy, increasing costs and weight, and requiring reduced load application during sealing.
Innovation Solution
A substrate holder design featuring a contact assembly with a seal member and a holder body, including pins and biasing members that apply a uniform sealing force directly to the substrate, reducing the load on the substrate and enhancing sealing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a continuous and integral seal is used to seal large-sized substrates, then the sealing coverage is improved, but the manufacturing precision of the seal and relevant components deteriorates due to difficulty in maintaining surface accuracy and dimensional accuracy over long distances
Solution Approach 1:
The continuous seal is divided into multiple discrete seal members (first seal member, second seal member, etc.) that are separately provided for different regions of the substrate. Each seal member can be manufactured with high precision independently, while collectively they provide comprehensive sealing coverage across the entire substrate surface.
2Area of stationary object
If the substrate size increases, then the sealing area is improved, but the substrate is more likely to warp and thin, making it difficult to apply uniform pressing force
Solution Approach 1:
The sealing force application is segmented into multiple independent seal members positioned at different locations on the substrate. Each seal member applies pressing force locally, and collectively they provide uniform sealing pressure across the entire substrate despite warpage or thinning in specific regions.
Solution Approach 2:
Each seal member is designed to provide localized sealing action with optimized pressing force for its specific region. This allows different parts of the substrate, even if they have different warpage or thickness characteristics, to receive appropriate sealing pressure tailored to their local conditions.
3Area of stationary object
If a continuous and integral seal is used for large-sized substrates, then the sealing coverage is improved, but the weight of the substrate holder increases
Solution Approach 1:
The seal structure is segmented into multiple separate seal members rather than one continuous seal. This reduces the total material quantity required while maintaining comprehensive sealing coverage, thereby reducing the weight of the substrate holder.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures effective sealing with reduced substrate load and improved manufacturing efficiency, maintaining sealing pressure despite substrate warpage or size variations, while minimizing the holder's weight and cost.
Implementation Method 1
at least one first biasing member placed between the locking member and the first plate along the outer circumferential part of the substrate such as to separate the locking member and the first plate from each other and compressed between the locking member and the first plate in the locked state to bias the first plate toward the contact assembly
Data Source
AI summary
There is provided a substrate holder. The substrate holder comprises a contact assembly; a first plate configured to hold a substrate between the contact assembly and the first plate; at least one first pin fixed to the contact assembly, extended toward a first plate side on outside of the substrate, and provided with a locked portion; a locking member placed on a side opposite to the contact assembly relative to the first plate and configured to be displaceable between a locked state and an unlocked state with respect to the locked portion of the first pin; and at least one first biasing member placed between the locking member and the first plate along an outer circumferential part of the substrate such as to separate the locking member and the first plate from each other and compressed between the locking member and the first plate in the locked state to bias the first plate toward the contact assembly.