Non-permeable Electroplating Carrier with Segmented Body
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Solution Overview
Problem
Conventional substrate carriers for electroplating face issues such as substrate breakage during loading, incomplete plating due to trapped plating solution residue, and lack of durability due to mechanical failures and chemical etching, leading to high downtime and replacement needs.
Innovation Solution
A non-permeable substrate carrier design with a flat, continuous body and internal cavities to prevent solution flow, featuring improved adhesion between thermoplastic and metal layers for a hermetic seal, and removably attached clips and pads to reduce downtime for maintenance and replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a conventional substrate carrier design with openings is used, then the carrier is lighter and allows solution flow, but it causes incomplete plating due to trapped plating solution residue and requires frequent replacement
Solution Approach 1:
The carrier body is segmented into a first body portion and a second body portion that can be separately manufactured and then joined together. This segmentation allows each portion to be optimized independently while maintaining overall structural integrity and preventing solution permeation through the joint interface.
Solution Approach 2:
The carrier employs a composite structure combining a non-conductive polymer material for the body portions with embedded conductive elements and metal components. This composite approach provides both the required electrical insulation and mechanical strength while preventing solution penetration.
2Reliability
If the carrier body is made non-permeable with a continuous structure, then plating completeness is improved by preventing residue trapping, but manufacturing complexity increases
Solution Approach 1:
Rather than manufacturing a single complex continuous body, the carrier is divided into multiple simpler body portions that are joined together. This segmentation reduces individual manufacturing complexity while achieving the overall non-permeable structure through proper joint design.
Solution Approach 2:
A joining interface or intermediary structure is used to connect the first and second body portions. This intermediary element ensures proper alignment, maintains the non-permeable barrier, and simplifies the manufacturing process by allowing separate fabrication of each portion.
3Strength
If clips and pads are permanently attached to the carrier, then structural integrity is improved, but downtime increases due to mechanical failures and chemical etching
Solution Approach 1:
The clips and pads are designed as separate, removable components rather than being permanently integrated into the carrier body. This segmentation allows for easy replacement of worn or damaged components without affecting the structural integrity of the carrier itself.
Solution Approach 2:
The removable clips and pads can be easily discarded when worn or damaged and replaced with fresh components. This approach minimizes downtime by allowing quick replacement of consumable parts without requiring carrier replacement or complex repair procedures.
4Ease of manufacture
If a single-piece carrier design is used, then manufacturing simplicity is improved, but durability decreases due to mechanical failures and chemical etching
Solution Approach 1:
The carrier is segmented into multiple body portions that can be manufactured separately using simpler processes and then joined together. This segmentation allows each portion to be optimized for manufacturing while the joined structure achieves superior durability through proper joint design.
Solution Approach 2:
The carrier uses composite construction with different materials for different portions, allowing each material to be selected for its optimal properties. This enables improved durability through material selection while maintaining manufacturing simplicity through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances substrate handling, ensures complete plating by preventing residue trapping, and increases carrier durability, reducing downtime and maintenance needs by allowing for easy replacement of worn components.
Implementation Method 1
the non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body
Implementation Method 2
electrically-conductive lines embedded within the carrier body
Implementation Method 3
the contact clips holding the substrates in place and electrically coupling the substrates to the electrically-conductive lines
Implementation Method 4
This causes reduction of the metal ions at the cathode so that a layer of the metal is deposited onto the substrate
Data Source
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AI summary
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.