Convex Electrochemical Replication Chuck for Uniform Plating
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Solution Overview
Problem
Existing chucks for electrochemical pattern replication (ECPR) face challenges in ensuring uniform plating/etching by failing to maintain consistent contact between the master electrode and substrate, leading to heterogeneous deposition and potential damage from high pressure, which can crack brittle semiconductor wafers.
Innovation Solution
A chuck with a convex interaction surface that conforms to the shape of the master electrode or substrate, combined with a flexible disc and vacuum channels, ensures continuous contact area increase towards the borders and minimizes electrolyte entrapment, allowing for controlled ECPR processes without excessive mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high pressure is applied to the master electrode or substrate to ensure contact, then contact between master electrode and substrate is improved, but the substrate may crack due to excessive mechanical stress
Solution Approach 1:
The chuck is designed with a convex interaction surface that matches the curvature of the master electrode or substrate. This curved surface allows the master electrode and substrate to conform to each other's shape, ensuring continuous contact across the entire interface without requiring excessive clamping pressure that could crack brittle semiconductor wafers.
2Stability of the object's composition
If rigid clamping is used to hold master electrode or substrate, then positioning stability is improved, but the chuck cannot adapt to different wafer sizes and shapes
Solution Approach 1:
The chuck incorporates a flexible disc made of elastomeric material that can deform to match the specific geometry of different wafers. This flexible element maintains stable positioning through elastic contact while adapting its shape to accommodate various wafer sizes and curvatures, eliminating the need for multiple rigid chuck designs.
3Ease of manufacture
If planar contact surface is used, then manufacturing simplicity is improved, but electrolyte entrapment occurs leading to heterogeneous plating/etching
Solution Approach 1:
The convex interaction surface on the chuck and the corresponding concave curvature on the master electrode or substrate create a conformal contact that eliminates air pockets and trapped electrolyte. This curved interface ensures uniform pressure distribution and continuous contact across the entire working area, preventing heterogeneous plating or etching while remaining manufacturable.
4Strength
If peripheral clamping is used to hold substrate, then substrate support is improved, but electrical contact is limited leading to poor deposition characteristics
Solution Approach 1:
The chuck provides support and electrical contact across the entire surface area of the master electrode or substrate, not just at the periphery. By distributing both mechanical support and electrical contact uniformly across the whole interface, the system achieves both strong substrate support and optimal deposition characteristics through improved current distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures uniform plating/etching by maintaining consistent contact and preventing electrolyte entrapment, reducing the risk of substrate damage and improving deposition characteristics, while allowing for flexible adaptation to different wafer sizes and shapes.
Implementation Method 1
said chuck comprising vacuum channels for providing a negative pressure in order to clamp said master electrode or said substrate to said interaction surface
Implementation Method 2
The lower chuck further comprises a flexible disc, arranged on top of or distally of the dome shaped or convex surface, such that the flexible disc concavely conforms to the dome shaped or convex surface
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3~4
AI summary
A chuck (500) for holding a master electrode or a substrate during an electrochemical pattern replication (ECPR) process is provided. The chuck comprises an interaction surface (506) on which the master electrode or the substrate is arranged, and attaching means for clamping said master electrode or said substrate to said interaction surface, such that said master electrode or said substrate is substantially conforming to the shape of said interaction surface (506) in a resting position. The chuck is provided with a void (504) proximally of the interaction surface (506), and a pressure channel (507) communicating with said void (504), such that an over pressure in said void (504) brings said interaction surface (506) into convex shape, such that said master electrode or said substrate arches distally in said resting position.