Contacting Part Buffering for Electronic Device Damage Reduction
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Solution Overview
Problem
Existing electronic devices face challenges in maintaining reliability and extending service life, particularly due to increased demands for lighter and thinner designs which can lead to higher susceptibility to damage and aging.
Innovation Solution
The electronic device incorporates a circuit structure with a contacting part that includes an insulating part with high elongation and a conductive layer, providing a buffering effect to reduce damage and slow down the aging of the circuit structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If electronic devices are developed towards being lighter and thinner, then the portability and compactness are improved, but the reliability and resistance to damage deteriorate
Solution Approach 1:
The patent applies beforehand cushioning by introducing a buffer layer between the circuit structure and the external environment. This buffer layer is specifically designed to absorb and dissipate external shocks and stresses before they can reach and damage the internal circuit components, thereby providing proactive protection against damage while maintaining the device's lightweight and thin profile
2Weight of moving object
If electronic devices are developed towards being lighter and thinner, then the portability and compactness are improved, but the service life deteriorates due to increased aging
Solution Approach 1:
The buffer layer serves as a protective barrier that cushions the circuit structure from environmental stresses such as thermal expansion, mechanical stress, and moisture intrusion. This beforehand cushioning effect reduces the aging rate of the circuit components by minimizing their exposure to degrading conditions, thereby extending the overall service life of the device
Solution Approach 2:
The patent employs composite material structures where the buffer layer is formed by combining materials with complementary properties - such as flexible polymers for stress absorption, heat-resistant ceramics for thermal management, and corrosion-resistant coatings for environmental protection. This composite approach allows the thin device structure to simultaneously achieve lightweight design, damage resistance, and extended service life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces damage to objects being detected and slows down the aging of the circuit structure, thereby enhancing the service life and reliability of the electronic device.
Implementation Method 1
The insulating part has high elongation and can be elastically deformed, and thus the contacting part has toughness and deformation and can provide a buffering effect
Data Source
AI summary
Disclosed are an electronic device and a manufacturing method thereof. The electronic device includes a circuit structure and at least one contacting part. The at least one contacting part is disposed on the circuit structure, and includes an insulating part and a conductive layer. The conductive layer surrounds the insulating part, and the conductive layer is electrically connected to the circuit structure. The electronic device disclosed herein may have a buffering effect or reduce damage to an object to be detected.