Non-Metallic Protective Coating Application TRIZ Cases
- Display Circuit Board Sealing Structure for Step Planarization
Sealing layers cover bent display circuit board edges to block external exposure and planarize stepped areas that cause visual defects.
- Folded Display Circuit Board Sealing for Edge Protection
Sealing material covers the top and side of a folded display circuit board to prevent edge damage and mask stepped portions.
- Coating Integrity Verification via Silver Nitrate Redox Reaction
Silver nitrate solution reacts with exposed metal to form visible deposits, replacing complex optical inspection methods.
- Cover Layer Thickness Variation for Display Device Rigidity
Varying cover layer thickness fills spaced spaces between display components to enhance structural rigidity.
- Protective Film for Metal Mesh Touch Sensor Oxidation
Cross-linked acrylic shielding prevents copper oxidation during storage, maintaining electrical conductivity without complex supply chain handling.
- Layered Structure Electrical Contacts via Segmented Overcoat
Segmented overcoat layers enable electrical contacts through thick coatings while maintaining transparency and conductivity.
- Flexible Transparent PCB Using PEN Film and Screen Printed Ink
Screen printing cycloaliphatic epoxy ink on a PEN substrate prevents wrinkling while maintaining optical clarity.
- Modified Epoxy Resin Composition for Heat Resistance
A modified epoxy resin composition replaces glycidyl groups with functional groups to enhance material properties.
- Contacting Part Buffering for Electronic Device Damage Reduction
An insulating part with high elongation inside a conductive layer absorbs mechanical stress to reduce damage and slow circuit aging in thin electronic devices.