Cover Layer Thickness Variation for Display Device Rigidity
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Solution Overview
Problem
Display devices face challenges due to step differences between the cover layer and underlying components, leading to vulnerability to external impact and requiring separate gap fill processes.
Innovation Solution
A display device design where the cover layer's thickness varies depending on areas to fill the spaced space between the cover layer and underlying members, enhancing rigidity against external impact and simplifying the manufacturing process by omitting separate gap fill processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a separate gap fill process is used to fill the spaced space between the cover layer and underlying members, then the rigidity against external impact is improved, but the manufacturing process complexity increases
Solution Approach 1:
The thickness of the cover layer is varied depending on the area: it is thicker in the spaced space region and thinner in the bonding layer region. This parameter change allows the cover layer itself to fill the spaced space, eliminating the need for separate gap fill processes while maintaining rigidity against external impact.
Solution Approach 2:
The cover layer is divided into different thickness regions corresponding to different functional areas: a first thickness region overlapping the spaced space, a second thickness region overlapping the bonding layer, and a third thickness region overlapping the printed circuit film. This segmentation allows each region to serve its specific function while collectively solving the rigidity and process simplification goals.
2Ease of manufacture
If the cover layer has uniform thickness, then the manufacturing process is simpler, but the spaced space remains vulnerable to external impact
Solution Approach 1:
The cover layer is designed with different thicknesses in different areas: thicker in the spaced space region to provide rigidity and protection against external impact, and thinner in the bonding layer region to maintain bonding effectiveness. This local quality variation resolves the contradiction between manufacturing simplicity and reliability.
3Strength
If the cover layer is made thicker to fill the spaced space, then the rigidity is improved, but the step difference between the cover layer and underlying members increases
Solution Approach 1:
The cover layer thickness is locally optimized: thicker only in the spaced space region where rigidity is needed, and thinner in the bonding layer region to minimize step difference. This localized approach maintains rigidity while reducing the overall step difference between the cover layer and underlying members.
Solution Approach 2:
The cover layer is segmented into multiple thickness regions: a first thickness region over the spaced space, a second thickness region over the bonding layer, and a third thickness region over the printed circuit film. This segmentation allows the cover layer to fill the spaced space effectively while the thinner second region minimizes the step difference, resolving the contradiction between rigidity and shape.
Data Source
AI summary
A display device includes a display panel configured to include a display area and a pad area around the display area; a printed circuit film configured to be attached to the pad area of the display panel; a cover layer configured to be disposed above the display panel and to overlap the printed circuit film; and a bonding layer configured to bond the display panel and the cover layer. The printed circuit film and the bonding layer have a spaced space between each other in a planar view. A thickness of the cover layer that overlaps the printed circuit film has a size between a thickness of the cover layer in the spaced space and a thickness of the cover layer on the bonding layer.