Modified Epoxy Resin Composition for Heat Resistance
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Solution Overview
Problem
Conventional epoxy resins, particularly liquid epoxy resins, fail to meet the increasing demands for improved heat resistance, water absorption resistance, and mechanical properties required in advanced electronic and electrical applications, such as high integration of circuits and use of lead-free solders.
Innovation Solution
A modified epoxy resin composition is developed, comprising a compound with a functional group represented by formula (1) and a glycidyl group, where the glycidyl groups in tris-(2,3-epoxypropyl)-isocyanurate are replaced with the functional group, and reacted with an acid anhydride in a specific molar ratio to create a liquid or solid resin with enhanced properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a crystalline epoxy resin is used to achieve high heat resistance, then heat resistance is improved, but the resin cannot be used for liquid molding applications
Solution Approach 1:
The patent applies parameter changes by modifying the molecular structure of the crystalline epoxy resin through chemical reaction with phenolic compounds. This transformation changes the physical state from solid to liquid while preserving the heat resistance properties, enabling the resin to be used in liquid molding applications.
Solution Approach 2:
The invention creates a composite modified epoxy resin by combining crystalline epoxy resin with phenolic compounds (having at least two phenolic hydroxyl groups per molecule). This composite structure maintains the heat resistance of the original crystalline resin while acquiring liquid-state properties for improved moldability.
2Ease of operation
If a liquid epoxy resin is used for liquid molding applications, then moldability is improved, but heat resistance and mechanical properties are insufficient
Solution Approach 1:
The patent transforms the molecular structure by introducing phenolic hydroxyl groups into the epoxy resin system. This structural modification enables the resin to exhibit liquid-state properties at room temperature while maintaining high heat resistance and improved mechanical properties in the cured state.
Solution Approach 2:
The invention develops a composite modified epoxy resin system combining phenolic compounds with epoxy resin. This composite approach allows the material to display both liquid-state processability and enhanced cured product properties including heat resistance and mechanical strength.
3Reliability
If conventional modified epoxy resins are used, then some properties are improved, but water absorption resistance and mechanical properties remain insufficient
Solution Approach 1:
The patent modifies the chemical structure by incorporating phenolic hydroxyl groups, which change the polarity and hydrophobicity of the resin system. This structural parameter change reduces water absorption tendency while maintaining and improving mechanical properties and overall reliability of the cured product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified epoxy resin composition exhibits excellent heat resistance, water absorption resistance, and mechanical strength, maintaining the advantages of polyfunctional epoxy resins while improving upon their drawbacks, and is suitable for applications like cast molding and transfer molding.
Implementation Method 1
a modified epoxy resin composition, comprising compound A having in its molecule a functional group represented by formula (1)... and compound B having a glycidyl group in its molecule
Data Source
AI summary
A crystalline epoxy resin is modified to provide an epoxy resin composition capable of producing a cured product with excellent cured product properties.The modified epoxy resin composition comprises compound A having in its molecule a functional group represented by formula (1):(where each of R1 and R2 is an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group, or a halogenated, aminated or nitrated derivative thereof), and compound B having a glycidyl group in its molecule. The compound A is preferably a compound resulting from replacement of from at least one to at most n glycidyl groups among n glycidyl groups in a molecule (where n is an integer of from 2 to 16) with the functional group of the formula (1). The compound B is preferably a compound having n glycidyl groups (where n is an integer of from 2 to 16) in its molecule.