Electronic Control Device Heat Radiation and Noise Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electronic control devices with both power-system and control-system components on a substrate, noise from power components can affect control components, and heat radiation from power components to the housing is insufficient, particularly in high-output motor driving applications.
Innovation Solution
The electronic control device features a substrate with divided power and control regions, where semiconductor modules are surface-mounted on the rear mounting surface adjacent to the housing, utilizing an electrically insulating and thermally conductive heat radiation layer to improve heat dissipation and a housing design with shorter distances between power and control regions to minimize noise interference, using parasitic capacitances to isolate noise sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power-system electronic components and control-system electronic components are mounted on one surface of a substrate, then device complexity is reduced, but noise from power components affects control components
Solution Approach 1:
The substrate surface is divided into distinct power region and control region, with power-system components mounted in the power region and control-system components mounted in the control region. This spatial segmentation prevents noise from power components from affecting control components while maintaining a compact single-surface arrangement.
2Ease of manufacture
If heat radiation is performed only from lead terminal to substrate, then manufacturing is simplified, but heat radiation performance is insufficient for high-output applications
Solution Approach 1:
The heat radiation path is extended from a single-point connection (lead terminal to substrate) to a multi-dimensional structure by adding a heat radiation fin that protrudes from the substrate surface. This increases the heat radiation surface area in the vertical dimension, significantly improving heat dissipation efficiency for high-output power components.
3Productivity
If device size is reduced for compact design, then productivity increases, but heat radiation and noise isolation become more difficult
Solution Approach 1:
The heat radiation fin extends in the vertical dimension perpendicular to the substrate plane, allowing the device to maintain a compact footprint while providing sufficient heat radiation surface area. This vertical extension enables effective heat management without increasing the horizontal device dimensions.
Solution Approach 2:
The substrate is segmented into power region and control region with spatial separation, allowing noise isolation without requiring additional distance in the horizontal plane. The power region contains power components with the heat radiation fin, while the control region contains control components, achieving noise isolation within a compact area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat radiation performance and reduces noise influence on control-system components, allowing for a compact device design while effectively managing heat and noise, particularly in high-output motor driving applications.
Implementation Method 1
heat can be radiated to the housing from a rear surface of the semiconductor modules opposed to the housing through an electrically insulating and thermally conductive heat radiation layer
Implementation Method 2
parasitic capacitances are generated between the semiconductor modules and the housing that is on a ground level. In this case, the first distance between the power region of the substrate and the power region corresponding part of the housing is shorter than the second distance between the control region of the substrate and the control region corresponding part of the housing. Therefore, a closed circuit bridged through the plurality of parasitic capacitances is formed mainly in an area of the power region and the power region corresponding part
Data Source
AI summary
In an electronic control device, semiconductor modules are disposed in a power region of a substrate, and on a surface of a substrate adjacent to a housing to radiate heat from rear surfaces to the housing through a heat radiation layer. Therefore, a heat radiation performance improves. Further, a first distance from an end surface of a power region corresponding part corresponding to the power region to the substrate is shorter than a second distance from an end surface of a control region corresponding part corresponding to a control region of the substrate to the substrate. Therefore, a closed circuit bridged by parasitic capacitances is formed mainly in an area of the power region and the power region corresponding part. A noise generated from the semiconductor modules is returned to noise sources through the closed circuit without affecting the control region.