Electric Motor Controller Cooling via Angled Plenum and Vapor Chambers
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Solution Overview
Problem
Existing cooling systems for electric motor controllers are inefficient in managing heat generated by power boards, leading to potential operational temperature issues and reduced performance.
Innovation Solution
The design incorporates a housing with integrated heat sinks and cooling fins, a plenum for directed airflow, and vapor chambers to enhance heat transfer and air circulation, specifically utilizing an angled wall to reduce backpressure and improve airflow over the heat sink, thereby increasing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are provided within the controller housing to absorb heat from the power board, then heat removal capability is improved, but the device complexity increases due to additional cooling components
Solution Approach 1:
The heat sink is integrated directly into the housing structure, merging the cooling function with the structural component. This eliminates the need for separate cooling components while maintaining effective heat removal capability from the power board.
Solution Approach 2:
The housing serves dual functions: providing structural containment and acting as a heat dissipation structure through integrated cooling fins. This multi-functionality reduces overall device complexity by combining support and cooling roles in a single component.
2Productivity
If a plenum with angled wall is used to direct airflow, then cooling efficiency is improved, but the device complexity increases
Solution Approach 1:
The plenum and angled wall structures are integrated into the housing design, merging the airflow direction function with the existing structural framework. This reduces the need for additional separate cooling components while maintaining effective airflow management.
Solution Approach 2:
The angled wall design creates optimized airflow paths that reduce turbulence and backpressure, improving cooling efficiency without requiring complex mechanical adjustments or movable parts.
3Volume of moving object
If multiple circuit boards are stacked in assembly, then space utilization is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The housing incorporates localized cooling fins and airflow channels positioned to target heat generation zones of stacked circuit boards. This localized approach enables effective heat dissipation from multiple boards without requiring excessive spacing between them.
Solution Approach 2:
Forced air circulation through the plenum and housing creates pneumatic cooling that penetrates through stacked circuit boards, enabling effective heat removal from multiple layers without increasing the overall footprint of the assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively transfers heat from heat-generating components to cooling fins, enhances airflow, and improves cooling efficiency, reducing operational temperatures and maintaining performance.
Implementation Method 1
The heat sink is configured to transfer heat generated by the heat generating components on the first circuit board from the interior to the cooling fins
Implementation Method 2
Air which is directed through the plenum flows over the second wall and through the air-flow channels
Implementation Method 3
Airflow from a forced air source is directed through a plenum and over an angled wall defined by the plenum. The forced air source increases airflow passing through the air-flow channels
Data Source
AI summary
The present disclosure relates to an electric motor controller having a plenum with a second wall designed to be angled to improve heat dissipation. In certain examples, the controller may have vapor chambers for cooling a plurality of circuit boards.