Cooling/Ventilation/Heating Modifications TRIZ Cases

Air guide geometry redirects radial fan exhaust into a linear main flow direction through the heat exchanger.

Angled radial fans divide volume flow to optimize operating points, improving acoustic properties while maintaining high power density in small spaces.

A flat coplanar heat exchanger directs coolant through upper and lower chambers to cool both sides of high-power electronics.

Ceiling-mounted air handling units with vertical plenums maintain compact shipping width while providing efficient cooling to modular data center aisles.

Metallic seals and dielectric plates prevent electrical shorting while maintaining thermal conduction for reliable power dissipation.

Rotating lids on immersion cooling containers isolate vapor and liquid regions, preventing coolant loss during server blade maintenance operations.

Adjustable weir and multifunctional handle manage dielectric fluid in immersion cooling systems.

A heat dissipation system uses a flow rate controller to regulate working fluid delivery for efficient phase change cooling.

A rackmount cooling system directs warmed air to an evaporator positioned beneath the equipment for recirculation.

A plastic pressing device uses Omega-shaped spring arms to apply force onto electronic components.

A partitioned base station uses liquid cooling for indoor devices and air cooling for outdoor wireless units.

Directing immersion fluid via a pump return connection through component cold plates resolves bulk flow limitations in fully populated tanks.

Variable speed fans and adjustable apertures maintain cold region pressure above hot zones, reducing energy consumption from excessive airflow.

Top and bottom air exhaust apparatuses draw warm air from the middle of a network cabinet enclosure, preventing upper mainboards from premature aging.

Angled plenum walls direct airflow through vapor chambers to cool electric motor controller circuit boards.

A field-replaceable bank of electronic components immersed in dielectric fluid for efficient heat rejection via a dedicated heat sink.

Separating dielectric and cooling liquids in distinct reservoirs resolves the trade-off between electrical insulation and thermal conductivity.

A spring-retained electronic stack uses inter-component cooling blocks to manage thermal loads in compact housing assemblies.

Leaf spring edges around through-openings distribute pressure to prevent surface damage while maintaining thermal contact.

Dual isolated heat sinks distribute heat for redundancy, resolving reliability and efficiency trade-offs.

Segmented modules with dynamic controls balance liquid and air cooling ratios, resolving manual tuning risks in mixed IT environments.

A cooling system uses a heat exchanger with separate primary and secondary fluid paths to manage thermal loads from power electronic devices.

Dual non-return valves prevent air backflow, ensuring continuous cooling when primary sources fail.

Segmented fan assemblies enable maintenance without downtime, while vertical airflow paths remove heat from densely packed components.

A two-phase cooling system uses an adjustable setpoint controller to manage refrigerant flow in electronics cabinets.

Oblique cooling element flanks divert warmed air to ensure fresh airflow reaches subsequent modules, resolving density versus cooling trade-offs.

Phase change material absorbs processor heat during fault bridging times, eliminating redundant active cooling circuits.

Normally open louvers pivot via gravity and airflow to prevent recirculation, eliminating the energy drain of maintaining closed flaps in low-power modes.

Air vents connect high-pressure and low-pressure sections to increase airflow volume in server enclosures.

Segmented modules form dedicated cold aisles to prevent heated exhaust from mixing with supply air, reducing energy waste.

A stackable server enclosure system uses aligned gas movers to circulate cooling air through interconnected compartments.

Segmented channel branches form sealed cavities that protect heating devices from water and dust while managing thermal loads.

Flow sensors and pumps manage liquid coolant rates, resolving interoperability gaps between single-phase and two-phase cooling solutions.

Conductive adhesive fills the housing before board insertion, eliminating separate pads and complex assembly while enabling automated production.

A cooling unit transitions from mechanical mode to economizer mode by progressively increasing outdoor air intake while decreasing recirculated return air.

Vertical tank arrangement and sliding frames overcome low power density in rectangular designs.

A two-sided cold plate assembly uses floating transfer tubes to maintain fluid communication between opposing cooling surfaces.

Metal sleeve seals dielectric plates to isolate electronic devices from conductive coolant.

A casing with internal partitions creates separate peripheral and central chambers for dual-mode ventilation using shared openings.

Merges lens barrel and camera housing into a unified structure to minimize alignment drift under thermal changes.

A containerized heat recovery unit uses horizontal extraction carrying means to slide modular heat exchangers in and out of the transport container.

Thermally activated louvers in slot-level cooling canisters regulate airflow to individual server subsets.

Sliding copper foils create a conductive path that dissipates heat from FPGA and CPU components in compact automation systems.

A modular air cooling device integrates an air cooling box with a heat exchange unit to circulate air and dissipate heat from electronic components.

Ribbed gap filler members seal lateral airflow paths between perpendicular electronics boards, preventing cooling air diversion and reducing energy consumption.

A molded thermal plastic fin shell dissipates heat from metal components to air while serving as a protective casing.

Segmented supply holes spray fluid while discharge holes suction it, preventing stagnation in data center racks.

A rack-mounted fluid distribution manifold with integrated supply and return lines connects to server cooling modules via a transmission mechanism.

Adjustable nested housings compensate for manufacturing tolerances, reducing thermal resistance while maintaining stability under dynamic forces.

Exposing anisotropic fillers at 3.5 to 45 percent overcomes limited enhancement capability while maintaining flexibility.